Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Job Title

Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Role Summary

Lead a High Bandwidth Memory (HBM) Product Engineering Media Health team to develop and execute intrinsic and extrinsic reliability tests for HBM stacked products (DRAM and interface die). The role focuses on reducing DPM, ensuring intrinsic reliability margins, and optimizing manufacturing test flows to meet quality, cost, and cycle-time KPIs.

The position requires cross-functional collaboration with Fab, Technology Development, Quality, Design, and System teams to identify reliability gaps, perform root-cause analysis, implement fixes, and support process conversions into high-volume manufacturing.

Experience Level

Senior level. The posting specifies 3 years of semiconductor industry experience; title indicates a senior role and leadership responsibilities.

Responsibilities

Core responsibilities include:

• Define and develop reliability stress methods, test flows, and qualification test plans for HBM products.
• Manage qualification execution with Global Quality and resolve gating issues during qualification.
• Drive extrinsic (Time 0 and Field) and intrinsic reliability DPM reduction through optimized manufacturing test strategies.
• Perform root-cause analysis of qualification and RMA failures using electrical and physical failure analysis and lead resolution efforts.
• Recommend and support front-end process conversions to improve yield, cost, and reliability in HVM.
• Assess and communicate risk with product managers and prioritize projects based on risk analysis.
• Promote technical innovation and improvements to maintain competitive advantage.
• Mentor and develop team members and build project management capability within the team.
• Collaborate cross-functionally with Fab, TD, Design, System Development, and Quality/Reliability teams.

Requirements

Must-have and preferred qualifications:

• Must-have: Strong leadership and people-management abilities; proven track record of leading technical teams or programs.
• Must-have: Strong problem-solving skills with root-cause understanding and circuit-level analysis experience.
• Must-have: Good knowledge of statistics, data analysis tools, and scripting for data-driven reliability assessment.
• Must-have: Demonstrated collaborative work across teams to resolve complex engineering and business problems.
• Must-have: Excellent communication and presentation skills; professional accountability and ownership.
• Must-have: Willingness to work on site in Singapore and travel internationally as required (US, Taiwan, Japan).
• Nice-to-have: Product engineering experience in semiconductor manufacturing.

Education Requirements

Bachelor's or Master’s degree in Electrical and Electronics Engineering. The posting specifies 3 years of semiconductor industry experience alongside the degree requirement.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.