Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Job Title

Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Role Summary

Lead a team responsible for intrinsic and extrinsic reliability test development and execution for Micron's HBM products (DRAM, interface die, and stacked products). Drive DPM reduction, intrinsic reliability margins, and optimized manufacturing test flows while collaborating with Fab, Technology Development, Quality, and Design teams.

This role focuses on technical leadership, cross-functional problem solving, and improving yield, quality, cost, and cycle time for HBM products.

Experience Level

Senior. The posting specifies 3 years of semiconductor industry experience; product engineering experience is preferred.

Responsibilities

Key responsibilities include defining reliability strategy, executing qualifications, and driving root-cause resolution and process improvements.

• Define and develop reliability stress tests, test flows, and qualification plans.
• Lead qualification execution and resolve gating issues with Global Quality and cross-functional teams.
• Drive down Extrinsic (Time‑0 and Field DPM) and improve Intrinsic Reliability via test strategy and manufacturing test flow optimization.
• Perform/debug reliability failures using electrical and physical failure analysis and drive corrective actions with fab and engineering teams.
• Recommend and support front-end process conversions to improve yield, cost, and reliability.
• Manage technical risk, prioritize projects, and make final technical decisions on risk analysis and project trade-offs.
• Develop and mentor engineering staff; build project management capability within the team.
• Partner across Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability to meet strategic and tactical objectives.
• Identify high-leverage AI/ML use cases for reliability; apply machine learning for fail segmentation, anomaly detection, and data-driven insights; coach engineers on AI adoption.

Requirements

Must-have technical and behavioral qualifications. Degree details are listed under Education Requirements.

• Proven leadership and technical problem-solving skills, including in-depth circuit-level analysis for root cause and solutions.
• Experience with statistics, data analysis tools, and scripting for handling reliability datasets.
• Product engineering experience in the semiconductor industry is preferred.
• Proven ability to collaborate across teams to address complex engineering and business problems.
• Strong communication and presentation skills; demonstrated mentorship and people leadership.
• Willingness to work on site in Singapore and travel internationally (US, Taiwan, Japan).
• Self-motivated, adaptable, and accountable with a professional work ethic.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering. The posting specifies 3 years of semiconductor industry experience. Product engineering experience is preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.