Senior Engineer, HIG-HBM Product Engineering (Media Health Manufacturing)

Job Title

Senior Engineer, HIG-HBM Product Engineering (Media Health Manufacturing)

Role Summary

Lead a team within the High Bandwidth Memory (HBM) Product Engineering Media Health function to develop, validate, and scale next-generation HBM products (DRAM, interface die, and stacked products). Focus areas include manufacturing test flow development, yield and reliability improvement, test-time reduction, and design-for-test (DFT) strategy.

Work cross-functionally with fab, design, technology development, test engineering and quality teams to meet quality, cost, cycle-time and scale targets for high-volume manufacturing.

Experience Level

Senior role. The posting specifies 7+ years of semiconductor industry experience; product engineering experience is preferred.

Responsibilities

Accountable for technical leadership and delivery across manufacturing test and media health for HBM products. Key responsibilities include:

• Lead development and validation of manufacturing test flows for DRAM, interface die and stacked HBM products.
• Optimize test coverage and test strategy across design architectures and process nodes.
• Perform in-depth circuit debug and root-cause analysis to improve device and stacked yield.
• Drive test-time reduction and cost-saving initiatives through DFT and test strategy innovations.
• Resolve manufacturing test flow, qualification (Qual), and RMA device issues.
• Mentor and develop team members and build a high-performing engineering organization.
• Make technical decisions on risk, prioritization and project trade-offs; incorporate AI tools to improve productivity where appropriate.
• Manage projects and collaborate with cross-functional teams (fab, design, technology, systems, quality/reliability) to deliver product objectives.
• Promote and implement technical innovations to maintain competitive advantage.

Requirements

Required skills, experience and attributes for successful performance in this role.

• 7+ years of experience in the semiconductor industry with relevant product engineering or manufacturing experience.
• Proven leadership and people-management experience; ability to build and lead teams.
• Strong problem-solving skills with demonstrated root-cause analysis via in-depth circuit analysis.
• Experience with test strategy, DFT concepts and manufacturing test flow development.
• Familiarity with statistics, data analysis tools and scripting for data-driven decisions.
• Proven cross-functional collaboration skills and experience working with fab, design and technology teams.
• Excellent communication and presentation skills; strong sense of ownership and accountability.
• Willingness to work on-site in Singapore and travel internationally (US, Taiwan, Japan) as required.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering. The posting specifies these degrees alongside the experience requirement (7+ years).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.