Senior Engineer, HIG HBM Package PE

Job Title

Senior Engineer, HIG HBM Package PE

Role Summary

Lead production support and product engineering for HBM package products after transfer to high-volume manufacturing. Manage a global team of product engineers focused on Quality, Cost, Cycle Time and Scale for next-generation HBM products.

The role requires cross-functional collaboration with FAB, technology development, design, test and reliability teams to resolve manufacturing issues, improve yields and drive cost and cycle-time reductions.

Experience Level

Senior — requires 8+ years of experience in the semiconductor industry (per role description).

Responsibilities

Accountable for sustaining and improving assembly and wafer-assembly yields, leading cross-functional initiatives, and developing engineering capability.

• Lead a global Package PE team for HBM products, set technical priorities and mentor engineers.
• Drive yield and quality improvements across assembly and wafer assembly flows; reduce Time‑0 and field DPM.
• Coordinate front-end and back-end process conversions with Fab, TD, APTD and PDE teams to stabilize product performance.
• Analyze manufacturing and reliability data using statistical tools, machine learning or AI to identify failure modes and improvement opportunities.
• Establish deviation alerting for yield loss, parameter trends, and wafer/die/cube shading.
• Manage qual/package qualification and RMA packaging issues.
• Drive cross‑functional cumulative yield ownership and lead improvement projects that impact cost and cycle time.
• Promote innovation and evaluate AI/agentic tools to increase operational productivity.

Requirements

Must-have technical and leadership qualifications for successful performance in this role.

• 8+ years semiconductor industry experience with demonstrated product engineering or packaging exposure.
• Proven leadership experience: leading teams and technical programs, mentoring engineers.
• Strong problem-solving and data-analysis skills; experience applying statistical methods and ML/AI to engineering data is expected.
• Track record of cross-functional collaboration with fab, test, reliability, design and technology development teams.
• Driven, adaptable, and accountable with professional work ethic.
• Experience with qualification, RMA investigation, and yield-loss root-cause analysis.
• Preferred: prior experience at Micron or in product engineering/packaging roles for memory products.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering (as stated in the posting).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.