Senior Engineer, APTD Operations

Job Title

Senior Engineer, APTD Operations

Role Summary

Manage technology development (TD) and advanced packaging test development (APTD) engineering builds for Fab 10A. Lead cross-functional planning, execution, and resource coordination to deliver TD project milestones on schedule.

This role partners with process, equipment, site planning, manufacturing, and external teams to ensure operational readiness, optimize build logistics, and maintain program documentation and status reporting.

Experience Level

Senior — the posting identifies this as a senior role. The job description lists 3–5+ years of semiconductor manufacturing or related experience as a guideline.

Responsibilities

Primary responsibilities include planning, executing, and overseeing engineering builds and operations to meet program requirements.

• Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders.
• Forecast build, material, cost, and resource requirements; maintain planning data and tools.
• Optimize build schedules, material preparation, and logistics to minimize delays and waste.
• Supervise daily execution tasks such as wafer offloading, kitting, and TD build support.
• Coordinate materials handling, sample submission for failure analysis, and related logistics as required by projects.
• Monitor status and program health; communicate updates to stakeholders and escalate risks to protect timelines.
• Lead cross-functional improvement initiatives and foster stakeholder partnerships across programs.
• Centralize and manage project documentation and data using SharePoint and Confluence.
• Ensure deliverables and artifacts meet program requirements and established business processes.
• Integrate AI-assisted tools and insights into daily work to improve efficiency and quality; identify and share AI-enabled improvements within scope of work.

Requirements

Must-have professional skills, tools familiarity, and behavioral capabilities.

• Experience in Semiconductor Frontend/Backend manufacturing and technology development.
• Familiarity with advanced packaging flows; experience with HBM is preferred.
• Experience in project/process integration, program management, operations management, or process engineering.
• Proficiency with Excel, Word, statistical tools, Confluence, Power BI, and Power Apps.
• Knowledge of SAP, Teamcenter, and manufacturing execution systems (MES).
• Familiarity with project management tools and systems.
• Strong analytical and problem-solving skills; ability to identify and mitigate risks.
• Outstanding communication, leadership, and stakeholder management skills.
• Ability to work independently and collaboratively in a fast-paced, global manufacturing environment.

Education Requirements

Bachelor's or master’s degree in Materials, Mechanical, Chemical, or Electrical/Electronic Engineering, or equivalent practical experience. The posting also references 3–5+ years of semiconductor manufacturing experience and allows equivalent experience in lieu of degree.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.