Senior Engineer, APTD Operations

Job Title

Senior Engineer, APTD Operations

Role Summary

Responsible for planning and executing technology development (TD) engineering builds and APTD operations at Fab 10A. Works with cross-functional teams — process, equipment, RDA, site planning, and manufacturing — to ensure timely delivery of program milestones and operational readiness.

Focus areas include build planning, resource and material forecasting, logistics coordination, execution oversight, and stakeholder reporting.

Experience Level

Senior. The posting requests approximately 3–5+ years of semiconductor manufacturing experience; title indicates senior-level responsibilities.

Responsibilities

Own planning and day-to-day execution of engineering builds and APTD operations to meet program requirements.

• Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders.
• Forecast build, material, cost, and resource requirements; maintain planning data and tools to ensure resource readiness.
• Optimize build schedules, material preparation, and logistics to reduce delays and waste.
• Supervise execution activities such as wafer offloading, kitting, and TD build support.
• Coordinate materials logistics and sample handling for failure analysis as required by projects.
• Monitor program status, communicate risks and overall health to stakeholders, and escalate issues to protect timelines.
• Lead cross-functional improvement initiatives and maintain project documentation (e.g., SharePoint, Confluence).
• Ensure deliverables meet program requirements and conform to established processes and standards.
• Integrate AI-assisted tools where appropriate to improve efficiency and quality; identify and share AI-enabled improvements within scope.

Requirements

Key qualifications, tools, and capabilities required for the role. Degrees and fields are summarized separately in Education Requirements below.

• 3–5+ years experience in semiconductor frontend/backend manufacturing; experience in project/process integration, program management, technology development, operations management, or process engineering.
• Practical understanding of advanced packaging flows.
• Proficiency with Excel, Word, statistical tools, Confluence, Power BI, and Power Apps.
• Familiarity with SAP, Teamcenter, and manufacturing execution systems (MES).
• Experience with project management tools and systems; ability to define schedules and manage dependencies.
• Strong analytical, problem-solving, communication, leadership, and stakeholder-management skills.
• Ability to work independently and collaboratively in a fast-paced, global manufacturing environment.
• Demonstrated ability to lead cross-functional teams and coordinate across diverse disciplines and cultures.
• Nice-to-have: minimum 1 year of HBM experience; prior leadership in global manufacturing networks.

Education Requirements

Bachelor's or master’s degree or equivalent practical experience in Materials, Mechanical, Chemical, or Electrical/Electronic Engineering.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.