Senior Design Engineer - Semiconductors & Tapeout Lead

Job Title

Senior Design Engineer - Semiconductors & Tapeout Lead

Role Summary

Primary technical and programmatic lead for device design and tapeout coordination at 1000 Micron Technology, Inc., Boise, ID. Serves as the main interface to partners and customers to drive design delivery and ensure compliance with technical standards and schedules.

The role focuses on coordinating design requests, overseeing layout and verification activities, managing interactions with wafer fabrication and procurement, and ensuring successful tapeouts.

Experience Level

Senior. Specific years of experience are not stated; this is a senior technical and coordination role expected to handle complex design and partner interactions.

Responsibilities

Core responsibilities include leading tapeout activities, coordinating stakeholders, and ensuring design quality and schedule adherence.

• Act as primary interface to partners and customers for device design and tapeout activities.
• Coordinate and prioritize device design requests across teams and external partners.
• Drive layout and verification efforts to meet technical and quality standards.
• Lead tapeout planning, schedules, and execution to meet delivery milestones.
• Manage semiconductor procurement and wafer fabrication interactions to support production needs.
• Ensure documentation, handoffs, and sign-offs are complete for design deliveries.
• Communicate status, risks, and mitigation plans to stakeholders and customers.

Requirements

Must-have technical skills and capabilities for performing the role.

• Demonstrated experience in layout and verification for semiconductor devices.
• Proven ability to coordinate tapeout processes and complex design schedules.
• Familiarity with semiconductor procurement processes and wafer fabrication workflows.
• Strong communication and stakeholder-management skills for customer and partner interactions.
• Attention to detail in documentation, sign-offs, and quality control.
• Ability to work cross-functionally with design, fabrication, and procurement teams.

Education Requirements

Master's degree in Engineering or a related field is required (e.g., MS in Electrical Engineering, Computer Engineering, or equivalent). No additional degree or certification information provided; equivalent academic credentials were not specified.

About the Company

Company: Retym Israel

Technology company hiring VLSI/ASIC digital design engineers for communication systems and SoC/IP development. Work includes RTL design, verification, synthesis, timing closure, and silicon bring-up.