Senior Assembly TD Engineer — Advanced Package Stacking

Job Title

Senior Assembly TD Engineer — Advanced Package Stacking

Role Summary

Lead technology development and transfer for advanced assembly and stacking processes (flip chip, TCB, hybrid bonding) to enable next-generation packaging. Work with materials, bumping, PI, NPI, quality and manufacturing teams to set up processes, run DOEs, characterize results, and transfer stable processes to high-volume manufacturing.

Experience Level

Senior — requires practical assembly/process experience. The posting specifies more than 3 years of assembly process experience.

Responsibilities

Core responsibilities include process development, experimentation, analysis, and transfer to production. Collaborate with cross-functional teams to meet development milestones.

• Evaluate and introduce new packaging technologies and materials (flip chip, TCB, hybrid bonding).
• Define plans and resource needs to enable new technology adoption.
• Design, execute and analyze DOE; build samples and interpret results.
• Troubleshoot process issues and drive efficiency improvements.
• Prepare documentation and lead process transfer from technology development (TD) to high-volume manufacturing (HVM).
• Monitor process stability using FDC, SPC and test data.
• Apply data analytics, AI, and automation tools to accelerate development, yield improvement and failure analysis.
• Manage multiple technical tasks independently and coordinate with materials, manufacturing and quality teams.

Requirements

Must-have technical skills and capabilities for this role.

• Hands-on experience with flip chip, TCB or hybrid bonding processes (wet processing, surface cleaning, plasma surface activation/treatment, or plasma-based dry etch processes).
• Strong technical problem-solving and data-analysis skills; able to interpret DOE and production data.
• Minimum ~3 years of experience in assembly/process development (as stated in posting).
• Fluent in English with strong written and verbal communication skills.
• Proactive, self-motivated, able to work independently and prioritize in a fast-paced development environment.
• Experience applying AI, data analytics or automation to process development is desirable.

Education Requirements

Master's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, or Chemistry (as stated). No alternative "equivalent experience" language was provided.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.