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Senior ASIC Packaging Engineer

Qualcomm
August 31, 2026
Full-time
On-site
San Diego, California, United States
$129,165 - $190,800 USD yearly
Other Semiconductor Jobs, Level - Senior

Job Title

Senior ASIC Packaging Engineer

Role Summary

Lead technical work to assess and mitigate manufacturability and reliability risks for new integrated-circuit packages. Work with internal design teams and external suppliers to define package design rules, set up manufacturing processes, and enable volume production.

Contribute to cross-functional reviews, author technical reports, and support customer bring-up and issue resolution related to package performance and yield.

Experience Level

Senior. Years of experience not specified in the source.

Responsibilities

Primary responsibilities include:

  • Plan and perform risk analysis, characterization, and mitigation for electronic packages.
  • Define package design rules and manufacturing process setup to ensure manufacturing readiness for volume production.
  • Evaluate manufacturability and reliability through technical assessment and empirical testing.
  • Coordinate cross-functionally and with external suppliers to resolve technical, schedule, and cost risks.
  • Author technical reports, presentations, and supplier-facing documentation.
  • Support customer new-product bring-up and manage customer issues related to packaging.
  • Participate as a key contributor in design reviews and project meetings.

Requirements

Key qualifications and skills (summary):

  • Proven experience in IC/package characterization, manufacturability assessment, and reliability evaluation.
  • Experience working with suppliers and coordinating cross-functional teams to enable volume production.
  • Strong technical communication skills; able to produce reports and presentations documenting risk assessments and mitigation plans.
  • Hands-on experience with manufacturing process setup and empirical testing methods for packages.
  • Analytical problem-solving skills and ability to lead technical investigations.

Nice-to-have: familiarity with specific advanced packaging technologies, failure analysis methods, and statistical/yield analysis tools.

Education Requirements

Master's degree (or foreign academic equivalent) in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field, as stated in the source.


About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.

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Date Posted: 2026-08-29