Senior Applications Engineer, Semiconductor 3D X-ray Solutions
Applied MaterialsJob Title
Senior Applications Engineer, Semiconductor 3D X-ray Solutions
Role Summary
Join a team of scientists and engineers developing 3D X-ray inspection and analysis solutions for semiconductor manufacturing, failure analysis, and R&D. The role partners with customers and internal product teams to define application needs, run evaluations and demos, develop workflows, and transfer application capabilities into product support.
Experience Level
Senior level. Typical experience: 3–5 years in semiconductor-related roles (fabs, failure analysis, metrology, process development).
Responsibilities
Primary customer-facing and technical responsibilities:
- Lead system demonstrations, onsite evaluations, and customer trials for fabs, FA labs, and R&D centers.
- Develop, validate, and document application-specific methodologies and workflows for inspection, metrology, and failure analysis.
- Provide technical input to product development and define application-driven system specifications and support plans.
- Perform tool characterization, benchmarking, baseline performance studies, and transfer capabilities to support teams.
- Deliver customer training, technical presentations, and lead technical review meetings.
- Support statement-of-work (SOW) creation, evaluation schedules, and onsite implementation until solution deployment.
- Represent the team at industry conferences, demos, and in technical publications.
Requirements
Must-have skills and experience; preferred items noted.
- 3–5 years of practical experience in semiconductor environments (fabs, failure analysis, metrology, or process development).
- Hands-on experience designing experiments, acquiring and analyzing data, and delivering measurable results in commercial or customer-facing settings.
- Experience with semiconductor inspection, metrology, or failure-analysis equipment and workflows.
- Strong problem-solving, technical communication, and presentation skills; ability to explain complex information to customers.
- Willingness and ability to travel for customer work (up to 30%).
- Nice-to-have: background in microscopy/advanced imaging (X-ray CT, SEM, FIB), working knowledge of X-ray absorption or imaging fundamentals, and familiarity with advanced packaging or 3D IC technologies.
Education Requirements
BS or MS in Materials Science, Physics, Electrical Engineering, or a closely related technical field.
About the Company
Company: Applied Materials
Headquarters: Santa Clara, CA, United States
Global leader in materials engineering solutions for the semiconductor and display industries, designing, manufacturing, and servicing equipment used to produce chips and advanced displays worldwide. Enables customers' production of semiconductor devices and display technologies and supports innovations like AI and IoT.
