Semiconductor Packaging Engineer

Job Title

Semiconductor Packaging Engineer

Role Summary

The Semiconductor Packaging Engineer develops, executes, and optimizes semiconductor and advanced packaging assembly and integration processes to support design, fabrication, validation, and scale-up of heterogeneous, flexible, and stretchable electronic systems.

This is an in-office, full-time contract role (expected duration ~12 months) working with research, hardware, and manufacturing teams to improve device performance, reliability, and manufacturability.

Experience Level

Entry-level / Early Career — guidance: 1+ years of relevant experience preferred.

Responsibilities

Lead engineering and hands-on work to develop and scale advanced semiconductor and electronic packaging processes.

• Lead assembly and integration efforts emphasizing SMT, die bond/wire bond, and related assembly processes.
• Develop and implement packaging solutions for heterogeneous, flexible, and stretchable electronics.
• Design and oversee internal, external, and hybrid manufacturing workflows to accelerate development and scale-up.
• Create and refine processes to improve performance, reliability, and yield through innovation and optimization.
• Plan and execute Design of Experiments (DOE); analyze data and apply results to optimize processes and yield.
• Operate and maintain advanced packaging and assembly equipment; identify in-line issues and implement solutions.
• Collaborate with researchers, hardware engineers, system integration teams, and external manufacturers.
• Support instrumentation development, process characterization, mechanical/layout design, and data analysis used in R&D environments.
• Follow company policies to protect sensitive data and maintain information security practices.

Requirements

Core must-have skills and conditions for the role.

• Minimum of 1+ years of relevant experience in semiconductor manufacturing, advanced packaging, or electronics manufacturing environments.
• Demonstrated hands-on experience with semiconductor assembly and packaging equipment and processes.
• Proven ability to design and execute DOE, analyze results, and optimize manufacturing yield.
• Strong analytical, troubleshooting, and problem-solving skills with a focus on scalability.
• Experience collaborating across R&D, hardware engineering, and manufacturing teams; strong written and verbal communication skills in English.
• Ability to work in a standard lab/production environment, use required PPE, stand for long periods (up to 12 hours), and lift up to 50 pounds unassisted.
• Pass a post-offer background verification.

Nice-to-have:

• Experience with FPC, PCBA, 2.5D/3D integration, SiP/MCM, FHE, or similar advanced packaging technologies.
• Familiarity with BEOL processes (thinning, dicing, TSVs, flip-chip, underfill), reliability testing and failure analysis, hermetic or MEMS packaging, thermal management, or molding processes.
• Experience with FEA or signal/power integrity simulation tools and wearable or soft-goods technologies.

Education Requirements

Bachelor's degree in Mechanical, Electrical, Aerospace, Chemical Engineering, Applied Physics, Materials Science, or a related technical field, or equivalent professional experience.

About the Company

Company: Sigma Design

Headquarters: Redmond, WA, USA

Product development, engineering, and manufacturing firm based in the Pacific Northwest that provides concept-to-production services, engineering, and manufacturing support for diverse global clients.