Semiconductor Packaging Engineer
fab2Job Title
Semiconductor Packaging Engineer
Role Summary
Hands-on packaging engineer responsible for developing and optimizing end-to-end semiconductor packaging processes (lithography, deposition, die attach, bonding, recipe creation) within a cross-functional hardware team. The role focuses on process development, reliability, and manufacturability, with exploration of 3D printing integration.
Experience Level
Mid-level. The role expects approximately 5+ years of semiconductor packaging experience.
Responsibilities
Work with the team to develop, test, and improve semiconductor packaging processes and materials, and maintain comprehensive documentation.
- Explore and validate novel semiconductor packaging processes and workflows.
- Plan and execute hands-on lab experiments end-to-end to test processes and materials.
- Create and refine process recipes for lithography, deposition, die attach, bonding, and related steps.
- Develop and test packaging materials, considering conductivity, mechanical strength, and thermal expansion.
- Evaluate process performance and implement continuous improvements for yield, reliability, and manufacturability.
- Provide technical support and collaborate with team members on experimental methodologies.
- Produce and maintain documentation and Standard Operating Procedures (SOPs); maintain equipment for safe, reliable operation.
Requirements
Must-have technical skills and experience; nice-to-have items listed separately.
- 5+ years of semiconductor packaging experience in research or industry with strong understanding of end-to-end packaging processes.
- Deep knowledge of packaging materials, thermal management, and reliability testing.
- Proven analytical and problem-solving skills; ability to troubleshoot complex packaging issues.
- Experience conducting hands-on lab work and developing process recipes.
- Strong documentation habits and experience creating SOPs and maintaining lab equipment.
Nice-to-have:
- Experience with 3D printing applied to electronics or packaging processes.
- Experience in metal plating.
- Mechanical engineering background or experience with mechanical processes.
- Familiarity with electronic design.
Education Requirements
Master's degree or equivalent experience in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field; "equivalent practical experience" is acceptable as stated in the posting.
About the Company
Company: fab2
Headquarters: Austin, TX, United States
Early-stage hardware startup that designs and builds semiconductor fabrication equipment, tools, and the hardware/software needed to make fabs. Works on lithography, metrology, motion systems and related components; founded by Sam Zeloof and Jim Keller with offices in Austin and San Francisco.
