Semiconductor Packaging Engineer

Job Title

Semiconductor Packaging Engineer

Role Summary

Design, develop, and implement semiconductor packaging products, structures, and assembly process technologies. Work with cross-functional Package Innovation teams and manufacturing sites to qualify and transfer package solutions into production.

Experience Level

Mid-level / Mid-career. Specific years of experience not specified.

Responsibilities

Primary responsibilities include technical development, cross-functional collaboration, and qualification of packaging solutions.

• Translate market and product requirements into packaging designs and process specifications.
• Design, develop and execute packaging product structures and assembly process technologies.
• Identify and resolve materials and processing issues during development.
• Collaborate with Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing teams.
• Use industry-standard project management tools to plan and track development projects.
• Collaborate with internal assembly sites and OSATs to qualify package solutions for production.
• Investigate and assess emerging packaging technologies and implement manufacturable solutions.
• Maintain technical knowledge, contribute to publications or patents as appropriate.
• May involve international travel to assembly sites and suppliers.

Requirements

Core skills and attributes required for the role.

• Experience in semiconductor packaging design, development, or process engineering.
• Familiarity with project management practices and tools; able to manage project schedules and deliverables.
• Strong written and verbal communication and presentation skills; effective cross-functional collaborator and team player.
• Ability to work in a fast-paced, changing environment and coordinate with global and local teams.
• Willingness and ability to travel internationally as required.

Nice-to-have:

• Knowledge of IC package types (QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP).
• Experience with statistical analysis and Design of Experiments (DOE).
• Experience or collaboration with electrical/thermal/mechanical modeling.

Education Requirements

M.S. or Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, or Electrical Engineering.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.