Semiconductor Operations - Advanced SiP Packaging

Job Title

Semiconductor Operations - Advanced SiP Packaging

Role Summary

Responsible for productization and high-volume manufacturing quality of advanced system-in-package (SiP), RF, antenna, mmWave, and high-density module technologies. Works with module suppliers, OSATs, PCB/substrate vendors, and system integration sites to drive NPI, process bring-up, supplier readiness, qualification, and quality improvements.

This role partners with Engineering, Operations, Reliability, and Quality teams to ensure products meet performance, reliability, cost, and form-factor requirements.

Experience Level

Mid-level. Requires 5+ years of relevant experience in product engineering, process engineering, semiconductor packaging, module productization, supplier quality, or high-volume manufacturing.

Responsibilities

Key responsibilities include:

• Drive NPI execution, process bring-up, and qualification readiness for advanced SiP and module technologies.
• Define design rules, materials, and process selections to meet thermo-mechanical, performance, reliability, quality, cost, and form-factor constraints.
• Lead supplier readiness and production ramp activities, including build-exit criteria, factory audits, and ramp-risk closure.
• Establish and monitor factory quality metrics and drive continuous quality and yield improvements.
• Resolve process, yield, reliability, and quality issues using data and failure analysis.
• Coordinate qualification and reliability testing at suppliers to meet product and process requirements.
• Ensure vendor compliance with specifications and manufacturing requirements.
• Partner cross-functionally with design, hardware, reliability, simulation/FEA, operations, and quality teams.
• Provide routine status reporting and escalate technical or supplier execution issues when needed.

Requirements

Must-have skills and experience:

• Deep knowledge of SiP, semiconductor packaging, module assembly, or advanced packaging processes, materials, substrates, and package-level failure mechanisms.
• Experience with SPC, DOE, FMEA, JMP or equivalent data-analysis tools and factory quality metrics.
• Strong understanding of reliability testing and failure mechanisms such as temperature cycling, board-level reliability, MSL, bHAST, CAF, warpage, and solder fatigue.
• Proven ability to work with suppliers/OEMs and drive supplier manufacturing/process control and production readiness.
• Strong interpersonal and communication skills for cross-functional collaboration.

Nice-to-have:

• Hands-on experience with factory audits, production readiness reviews, and supplier quality systems.
• Experience with RF, mmWave, antenna or wireless modules and high-density package architectures.
• Track record of taking advanced packages or modules from development builds to high-volume manufacturing.
• Ability to communicate technical risk clearly and provide concise executive-level updates.

Education Requirements

MS or BS in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline as stated in the posting.

About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.