R&D SW/FW Management Director

Job Title

R&D SW/FW Management Director

Role Summary

Lead software and firmware architecture and delivery for custom ASIC and general‑market interface products in R&D. Own SW/FW strategy from product definition through silicon tapeout and system integration, coordinating cross‑functional teams to enable timely, high‑quality firmware releases and scalable customer deployment.

Experience Level

Senior-level — requires 15+ years' experience in embedded firmware, portable systems software, or related fields.

Responsibilities

Lead and manage SW/FW architecture, delivery, and cross‑functional integration. Key responsibilities include:

• Translate system and product requirements into FW/SW architecture and align expectations with Product, HW design, Verification, Applications, and validation teams.
• Define modular, reusable FW/SW partitioning and oversee implementation to meet schedule and quality targets.
• Establish and improve execution flows, verification practices, and unit-level FW verification using FPGA platforms and coverage metrics before tapeout.
• Drive team efficiency, including evaluation and adoption of AI/ML tools where they add measurable value.
• Anticipate schedule and technical risks and implement mitigation plans to ensure on-time deliveries.
• Engage with OEMs and Tier‑1 partners to gather requirements and translate feedback into product improvements.
• Represent SW/FW in customer discussions across definition, bring‑up, launch, and post‑ramp support.
• Mentor and motivate the engineering team, providing hands‑on technical leadership.

Requirements

Must-have technical skills and experience:

• 15+ years in embedded firmware, portable systems software, or related roles.
• Strong low-level software background: drivers, bootloaders, firmware, RTOS and non‑RTOS architectures.
• Experience with ARM and RISC SoC/ASIC platforms and HW/SW integration and system bring‑up.
• Proven technical leadership, product management, and system architecture experience.
• Customer-facing experience with OEMs or Tier‑1 partners.

Nice-to-have:

• Experience with FPGA-based validation, code‑coverage metrics, and pre‑tapeout verification workflows.
• Familiarity with silicon tapeout processes and managing firmware freeze strategies.
• Experience applying AI/ML tools to improve engineering productivity or quality.

Education Requirements

Not specified.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.