R&D Process Engineer

Job Title

R&D Process Engineer

Role Summary

Responsible for designing and implementing packaging processes for optocoupler and isolation products in an R&D environment. Works with IC designers, product engineers, manufacturing teams and contract manufacturers to develop, validate and transfer new device processes.

Main objectives include process development, yield and reliability evaluation, and delivering cost, quality and yield improvements through engineering programs.

Experience Level

Mid-level. The posting does not specify years of experience but expects demonstrated experience in semiconductor packaging and optocoupler process development.

Responsibilities

Primary responsibilities include:

• Design and implement packaging processes for new isolation/optocoupler products.
• Evaluate material reliability, material properties, and processing techniques; explore new production methodologies.
• Plan and execute Design of Experiments (DOE) and optimize newly developed processes.
• Collaborate with IC designers, product engineers, manufacturing, support functions, and contract manufacturers to develop and validate device processes.
• Perform process yield analysis and failure investigations for new-device issues.
• Plan and run engineering programs to achieve cost reduction targets and drive improvements in manufacturing yield, quality, and reliability.

Requirements

Must-have technical skills and experience:

• Proven experience with optocoupler products and semiconductor packaging process development.
• Hands-on experience with Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and vision inspection tools.
• Familiarity with mechanical leadframe design rules/tools and semiconductor physical failure analysis.
• Experience with IC packaging, high-voltage isolation requirements, materials, and processing techniques.
• Strong analytical and problem-solving skills with a solution-oriented mindset.
• Experience with SolidWorks, Ansys, CAD or similar simulation tools.
• Ability to collaborate across design, manufacturing, and contract partners to transfer processes into production.

Nice-to-have:

• Experience leading NPI projects and taking products from verification/qualification through high-volume soft launch.

Education Requirements

Background in Mechanical Engineering or a similar technical discipline is referenced. No specific degree level or certifications are stated; equivalent practical experience appears acceptable.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.