Job Title
R&D Engineer, IC Design
Role Summary
Design and implement ASIC components using advanced CMOS cell-based ASIC technologies. Work with internal and external teams through RTL, synthesis, timing, simulation, physical implementation and post-prototype validation. Primary focus includes advanced-node designs (e.g., 28nm, 16FF).
Experience Level
Mid-level (Mid-Career). The posting does not state specific years of experience but expects proven ASIC/tapeout experience.
Responsibilities
Own and execute IC design tasks across RTL-to-GDSII phases and support post-prototype verification and debug.
- Perform RTL analysis, synthesis, and design optimization.
- Develop timing constraints and run STA/full-chip timing closure.
- Conduct simulation, test insertion, and vector generation for verification.
- Support physical design activities including floorplanning, placement and design closure.
- Participate in DRC/LVS checks and coordinate with layout teams.
- Provide post-prototype test support and debug with internal/external customers.
- Independently handle block implementation and top-level integration tasks.
Requirements
Key technical skills and attributes required; preferred items listed separately.
- Solid VLSI background and strong understanding of the ASIC design flow.
- Ability to handle block implementation and top-level tasks independently.
- Tapeout experience at 28nm (and advanced-node) process technology.
- Proven communication and problem-solving skills.
- Proficiency with scripting (Perl and Tcl).
Preferred / nice-to-have:
- Experience with DFT insertion.
- Power analysis / IR/IVD analysis experience.
- Experience with DRC/LVS flows in physical verification.
Education Requirements
Not specified.
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.

Date Posted: 2026-06-18