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R&D Engineer, IC Design

Broadcom
June 23, 2026
Full-time
On-site
Shanghai, China
Physical Design Jobs, Level - Mid-Career

Job Title

R&D Engineer, IC Design

Role Summary

Design and implement ASIC components using advanced CMOS cell-based ASIC technologies. Work with internal and external teams through RTL, synthesis, timing, simulation, physical implementation and post-prototype validation. Primary focus includes advanced-node designs (e.g., 28nm, 16FF).

Experience Level

Mid-level (Mid-Career). The posting does not state specific years of experience but expects proven ASIC/tapeout experience.

Responsibilities

Own and execute IC design tasks across RTL-to-GDSII phases and support post-prototype verification and debug.

  • Perform RTL analysis, synthesis, and design optimization.
  • Develop timing constraints and run STA/full-chip timing closure.
  • Conduct simulation, test insertion, and vector generation for verification.
  • Support physical design activities including floorplanning, placement and design closure.
  • Participate in DRC/LVS checks and coordinate with layout teams.
  • Provide post-prototype test support and debug with internal/external customers.
  • Independently handle block implementation and top-level integration tasks.

Requirements

Key technical skills and attributes required; preferred items listed separately.

  • Solid VLSI background and strong understanding of the ASIC design flow.
  • Ability to handle block implementation and top-level tasks independently.
  • Tapeout experience at 28nm (and advanced-node) process technology.
  • Proven communication and problem-solving skills.
  • Proficiency with scripting (Perl and Tcl).

Preferred / nice-to-have:

  • Experience with DFT insertion.
  • Power analysis / IR/IVD analysis experience.
  • Experience with DRC/LVS flows in physical verification.

Education Requirements

Not specified.


About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.

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Date Posted: 2026-06-18