Quantum Superconducting Interconnect Integration Engineer

Job Title

Quantum Superconducting Interconnect Integration Engineer

Role Summary

Join the Quantum Advanced Packaging team to develop and integrate cryogenic superconducting interconnect and interposer technologies for scalable quantum systems. This R&D role owns end-to-end process development, prototyping, and transition-to-manufacturing for superconducting interconnects and 2.5D/3D interposer solutions.

Experience Level

Senior level — requires substantial prior experience (guidance: 10+ years of related work experience is indicated in the posting).

Responsibilities

Responsible for technical leadership of superconducting interconnect and interposer integration from concept through prototyping and transfer to scalable manufacturing.

• Lead development of superconducting interconnect and interposer processes (e.g., Nb, Al, In, superconducting liners, RDL).
• Design and specify 2.5D and 3D cryogenic interposer architectures for quantum systems.
• Define routing, metallization, and integration schemes optimized for low-loss RF/microwave propagation, minimal thermal leakage, and cryogenic reliability.
• Own wafer-level and die-level integration flows (RDL, TSV/TOV, via formation, bumping, bonding, assembly interfaces).
• Translate system-level requirements into interconnect density, pitch, and routing specifications.
• Enable early-stage prototyping, coordinate fab and assembly execution, and support scale-up to manufacturable flows.
• Identify failure modes (interconnect degradation, cryogenic stress defects, interface reliability), lead root-cause analysis, and implement corrective actions.
• Collaborate with device, test, reliability, modeling teams, OSATs, suppliers and research partners to co-develop solutions and validate at cryogenic conditions.
• Define equipment and supplier requirements for superconducting metallization and advanced 3DHI integration; produce integration flow documentation and process specs.
• Contribute technical reports, IP, publications, and packaging roadmaps aligned with quantum system scaling.

Requirements

Core technical skills and experience required to perform the role; preferred attributes listed where applicable.

• Must-have: 10+ years of related R&D or process integration experience in interconnect, interposer, or advanced packaging for cryogenic or high-performance systems.
• Deep knowledge of superconducting materials, cryogenic material behavior, and superconducting metallization integration.
• Experience with RDL, TSV/TOV, via formation, bump/bonding, and multi-die/3D integration workflows.
• Proven ability to define routing/metallization schemes for low-loss RF/microwave and low thermal leakage environments.
• Demonstrated experience driving prototyping, process integration planning, yield and manufacturability improvements.
• Hands-on root-cause analysis and cross-functional problem solving with fabrication and assembly teams.
• Strong collaboration skills with device teams, test engineers, suppliers and OSATs; able to translate system requirements to process specifications.
• English fluency (written and verbal) and willingness to travel up to 20%.
• Nice-to-have: prior leadership or project management experience, strong written/verbal communication, and planning/organizational skills.

Education Requirements

Required: Master’s degree (MS) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or a related technical field from an accredited program; the posting specifies an MS with at least 10 years of related work experience and a minimum overall GPA of 3.0. Preferred: PhD-level education is preferred (posting indicates PhD preferred with ~8+ years of related experience). Accredited degree and GPA requirements explicitly stated in the source.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.