Quantum Superconducting Interconnect Integration Engineer

Job Title

Quantum Superconducting Interconnect Integration Engineer

Role Summary

Join the Quantum Advanced Packaging team to develop and integrate cryogenic superconducting interconnect and interposer technologies for scalable quantum systems. The role owns end-to-end interconnect integration from wafer- and die-level processes through prototyping and transition to manufacturable flows.

Experience Level

Senior. The posting specifies advanced experience consistent with a senior R&D engineer (posting indicates a Master's + ~10 years or PhD + ~8 years of related experience).

Responsibilities

Technical and program leadership across interconnect and interposer integration for cryogenic quantum systems.

• Lead development of superconducting interconnect and interposer processes (e.g., Nb, Al, In, superconducting liners, RDL).
• Design 2.5D and 3D cryogenic interposer architectures and multi-die packaging solutions (qubit die + control electronics + superconducting interposers).
• Define routing, metallization, and integration schemes optimized for low-loss RF/microwave propagation, minimal thermal leakage, and cryogenic reliability.
• Own wafer-level (RDL, TSV/TOV) and die-level (bump, bonding, assembly) integration flows and transition to manufacturable processes.
• Drive process integration planning, prototyping lots, and execution across fab and assembly lines.
• Identify failure modes (interconnect degradation, cryogenic stress defects, interface reliability), lead root-cause analysis, and implement corrective actions.
• Collaborate with device, test, reliability, and modeling teams to preserve qubit performance and meet cryogenic electrical/thermal constraints.
• Work with equipment vendors, suppliers, and OSATs to define tool/process requirements for superconducting metallization and interposer fabrication.
• Support system-level validation and characterization at cryogenic conditions; produce integration documentation, specs, and technical reports.

Requirements

Must-have technical skills, domain knowledge, and work practices.

• Proven experience integrating superconducting interconnects and interposers and familiarity with relevant materials and process flows (RDL, TSV/TOV, bumping, bonding).
• Knowledge of cryogenic material behavior, thermal management, and low-loss RF/microwave routing at cryogenic temperatures.
• Hands-on experience with prototyping through fab and assembly; focus on manufacturability, yield, and cycle-time reduction.
• Demonstrated problem-solving and root-cause analysis for reliability and interface issues.
• Experience collaborating across device, assembly, reliability, and supplier teams; ability to translate system requirements into interconnect specifications and design rules.
• Track record of producing integration flow documentation, process specs, and technical reports; contributions to IP or publications are a plus.
• Strong written and verbal communication and cross-functional leadership skills.
• English fluency (written and verbal) and willingness to travel up to 20%.

Education Requirements

Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field from an accredited program; the posting specifies a Master’s with ~10 years of related experience. A PhD is preferred (posting indicates PhD preferred with ~8 years of related experience). Posting also specifies a minimum overall 3.0 GPA.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.