Quantum 3D Integration and Packaging Engineer

Job Title

Quantum 3D Integration and Packaging Engineer

Role Summary

Develop and deliver 3D integration and advanced packaging solutions for quantum devices within Applied Materials' CTO group. The role focuses on designing experiments, characterizing hardware and materials, optimizing processes, and reducing device error rates through materials and packaging innovations.

Collaborate with internal process, hardware, metrology, and R&D teams and with external partners (customers, startups, universities) to prototype, test, and document packaging and integration approaches for superconducting qubits and related quantum technologies.

Experience Level

Mid-level (Level - Mid-Career). Typical candidates have roughly 3–7 years of relevant experience in semiconductor packaging, process engineering, or 3D integration; however, specific years of experience are not stated.

Responsibilities

Design, execute, and analyze experiments to develop 3D integration and packaging for quantum platforms. Communicate results and collaborate across functional teams and external partners.

• Create 3D integration and packaging solutions for various platforms and quantum structures.
• Develop new materials, processes, and structures in partnership with advanced packaging, process, hardware, and metrology teams.
• Plan and run experiments; collect, analyze, and interpret data; compile technical reports and presentations.
• Troubleshoot complex process and hardware issues; perform root cause analysis and implement corrective actions.
• Measure material and device properties and perform hardware characterization.
• Produce internal and external documentation for products, designs, and experiments.
• Monitor advances in 3D integration, quantum information, and related fields to incorporate new techniques and technologies.
• Collaborate with customers, startups, and universities to identify problems and develop enabling solutions.

Requirements

Must-have technical skills and experience required for successful performance in this role. Education requirements are listed separately below.

• Proven background in semiconductor packaging, 3D integration, or process development for advanced devices.
• Hands-on experience designing and executing process engineering experiments, data collection, and statistical/technical analysis.
• Experience with hardware characterization, metrology, and measuring material/device properties.
• Strong troubleshooting and root-cause-analysis skills for complex process and hardware issues.
• Ability to generate clear technical documentation and present findings to technical and non-technical stakeholders.
• Experience working cross-functionally with R&D, process, metrology, and supply chain partners.
• Willingness to travel up to approximately 10% for collaboration and validation.
• Nice-to-have: experience with quantum devices (e.g., superconducting qubits), optical/metasurface-based optics, advanced materials engineering, or prior collaboration with university/industry research teams.
• Nice-to-have: prior experience leading small projects or mentoring junior engineers.

Education Requirements

Doctorate degree required. Field of study not specified in the posting.

About the Company

Company: Applied Materials

Headquarters: Santa Clara, CA, United States

Global leader in materials engineering solutions for the semiconductor and display industries, designing, manufacturing, and servicing equipment used to produce chips and advanced displays worldwide. Enables customers' production of semiconductor devices and display technologies and supports innovations like AI and IoT.