Job Title
Quality Reliability Engineer
Role Summary
Lead technical activities to ensure board-level quality and long-term reliability for advanced semiconductor packages and board assemblies. The role directs qualification planning, failure analysis, risk assessment, and reliability demonstration across development, qualification, and production phases.
Works cross-functionally with product development, packaging, manufacturing, suppliers, and customers and represents the company in industry standards forums related to quality and reliability.
Experience Level
Mid-level. Typical candidates meet the posted minimums (Master's + 3+ years industry experience, or Ph.D. + 1+ year); expect several years of hands-on semiconductor or electronic system reliability work.
Responsibilities
Accountable for board-level reliability strategy, qualification, investigations, and standards engagement.
- Develop and execute qualification plans: thermal cycling, mechanical shock, vibration, drop, power cycling, humidity, and use-condition testing.
- Set reliability requirements and acceptance criteria from customer and market needs.
- Lead risk assessments (FMEA, fault tree), reliability growth planning, and statistical confidence strategies.
- Lead complex failure analysis and root-cause investigations; drive corrective and preventive actions across design, materials, assembly, and manufacturing.
- Perform reliability data analysis: Weibull analysis, DOE studies, and other statistical methods.
- Represent the company in JEDEC, IPC, AEC and similar standards bodies; author and review qualification methodologies and standards documents.
- Communicate technical findings and reliability risks to stakeholders and produce qualification and investigation reports.
Requirements
Technical skills and experience required to perform the responsibilities. Degree requirements are listed under Education Requirements below.
-
Must-have:
- Experience in semiconductor package, board-level, or electronic system reliability and qualification.
- Knowledge of reliability qualification methods: thermal cycling, shock, vibration, temp-humidity, and accelerated stress testing.
- Understanding of solder interconnect reliability, PCB technologies, SMT assembly, and package-to-board interactions.
- Experience in failure analysis, root-cause determination, and implementing corrective actions.
- Proficiency with reliability statistics (Weibull), DOE, and data analysis techniques; working knowledge of FMEA and risk assessment methods.
- Familiarity with JEDEC reliability/qualification standards and willingness to participate in industry standards work.
- Strong cross-functional collaboration and technical writing skills to produce qualification reports and communicate results.
-
Preferred / Nice-to-have:
- Experience with advanced packaging (FCBGA, flip-chip, heterogeneous integration, chiplets, 2.5D/3D).
- Knowledge of thermo-mechanical failure mechanisms: solder fatigue, pad cratering, substrate cracking, delamination, warpage.
- Familiarity with finite element modeling (FEM) or physics-of-failure approaches.
- Prior participation in JEDEC, IPC, or similar standards committees and contribution to reliability specifications.
Education Requirements
Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Reliability Engineering, Physics, or a related technical field with 3+ years of industry experience; OR Ph.D. in those fields with 1+ years of industry experience. Fields of study include materials, mechanical, electrical, reliability, physics, or related technical disciplines. No certifications were specified.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Date Posted: 2026-08-05