Product Yield Enhancement Engineer, HBM

Job Title

Product Yield Enhancement Engineer, HBM

Role Summary

Join the manufacturing team responsible for bringing High Bandwidth Memory (HBM) products from design through high-volume production. The role focuses on failure analysis across production test, qualification, and customer returns to identify root causes and enable faster production ramp and improved reliability.

Experience Level

Entry-level - requires approximately 2 years of semiconductor industry experience in yield engineering, fault isolation, or failure analysis.

Responsibilities

Primary responsibilities include electrical and physical failure analysis, data-driven root cause determination, reporting, and cross-functional problem resolution.

• Perform electrical failure analysis and fault isolation using emission microscopy, laser-based methods, EOTPR, and similar techniques.
• Analyze and model failure signatures from backend testing, qualification, and RMA data.
• Apply physical failure analysis (PFA) and de-processing techniques to isolate defects.
• Maintain and apply technical knowledge of CMOS/FinFET fabrication processes, device structures, and process integration.
• Generate clear, organized failure analysis reports with root-cause findings and corrective-action recommendations.
• Collaborate with Product, Process, Assembly, Quality, and Management teams to communicate findings and drive resolution.
• Use AI-assisted tools and workflows to analyze large datasets, identify failure patterns, and accelerate root-cause determination.
• Support flexible work schedules, including swing or night shifts as required by business needs.

Requirements

Must-have technical skills, experience, and capabilities. Preferred items are listed at the end.

• Minimum ~2 years of semiconductor industry experience in yield engineering, fault isolation, or failure analysis.
• Experience with CAD tools for layout and schematic analysis.
• Strong understanding of semiconductor device physics and VLSI design principles.
• Proficiency in scripting within UNIX/Linux environments (Tcl, Bash, Shell).
• Ability to produce organized technical reports and communicate results to cross-functional teams.
• Willingness to work flexible hours, including night or swing shifts when required.
• Nice-to-have: hands-on fault isolation and failure analysis experience; knowledge of packaging, assembly, and fabrication workflows; reliability engineering and quality-analysis experience; experience using AI-assisted analytics for anomaly detection and yield improvement.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Materials Science, Computer Engineering, Physics, Chemistry, or equivalent practical experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.