Product Test Engineer II

Job Title

Product Test Engineer II

Role Summary

Join the Product & Test Engineering team to enable high-quality, scalable launches of wireless SoCs and modules across BLE, Zigbee, Wi‑Fi, and IoT applications. This role bridges Design, Quality, and Manufacturing to ensure robust releases, strong yield, and reliable high-volume production from first silicon through lifecycle support.

The position focuses on silicon bring-up, qualification, production test development, yield improvement, and cross-functional technical leadership.

Experience Level

Mid-level. Typical requirement: 5+ years' experience in semiconductor product and/or test engineering for high-volume products.

Responsibilities

Primary responsibilities include product characterization, test development, yield analysis, and technical leadership.

• Own product engineering from first silicon through NPI and production ramp across wafer sort and final test.
• Lead silicon bring-up and characterization across PVT (process, voltage, temperature); define guardbands and release criteria.
• Plan and execute qualification activities (JEDEC/AEC) including reliability strategy and stress validation.
• Define production test strategy aligned with product architecture and customer requirements.
• Develop and release scalable ATE test programs (e.g., Teradyne UltraFlex/J750) and optimize test time, coverage, and cost.
• Design and qualify manufacturing test hardware (load boards, burn-in boards) and manage OSAT transfer and correlation.
• Analyze wafer probe and final test data to drive yield and screening effectiveness; lead root cause analysis for yield excursions and test escapes.
• Monitor fab and test KPIs to sustain stable mass production.
• Mentor engineers, lead cross-functional technical reviews, and drive methodology, automation, and process improvements.

Requirements

Must-have skills and experience:

• 5+ years in semiconductor product and/or test engineering for high-volume products.
• Strong understanding of wafer sort, final test, and IC manufacturing fundamentals.
• Solid understanding of ATE fundamentals (DC/parametric, digital, timing, instrumentation).
• Experience with ATE platforms (e.g., Teradyne UltraFlex, J750, or equivalent).
• Proficiency in C/C++ and Python for test development or data analysis.
• Strong statistical and data analysis capability.
• Experience debugging test hardware and software in manufacturing environments.

Nice-to-have:

• Experience with wireless/IoT SoCs (BLE, Zigbee, Wi‑Fi, Matter).
• Experience with analog, mixed-signal, or RF production test methods.
• Knowledge of JEDEC/AEC qualification and reliability standards.
• Experience with burn-in design and stress patterns (HTOL, ELFR, HAST).
• Familiarity with automation frameworks and version control (e.g., Git).
• Experience working in global cross-functional teams.

Education Requirements

BS or MS in Electrical Engineering or a related technical field (BS/MS in Electrical Engineering or related field).

About the Company

Company: Silicon Labs

Headquarters: Austin, Texas, USA

Silicon Labs is a leading innovator in low-power wireless connectivity, creating embedded technology that connects devices to improve lives. With a focus on advanced edge connectivity applications, the company provides device makers with cutting-edge solutions and support. Headquartered in Austin, Texas, Silicon Labs operates in over 16 countries, serving markets such as smart home, industrial IoT, and smart cities.