Product Packaging Engineer

Job Title

Product Packaging Engineer

Role Summary

The Product Packaging Engineer will design, develop, qualify, and optimize packaging solutions for advanced semiconductor products, supporting performance, manufacturability, scalability, and sustainability.

This role works with cross-functional teams across engineering, manufacturing, supply chain, and quality to move packaging concepts from prototype through qualification and production.

Experience Level

Entry-level: typically 1+ years of relevant engineering experience with a Bachelor’s degree; candidates with a Master’s or PhD may qualify with no prior experience.

Responsibilities

Primary responsibilities include developing packaging materials and processes, ensuring manufacturability and reliability, and supporting production readiness.

• Design, develop, and qualify packaging materials, components, and assemblies for semiconductor products.
• Lead development from concept and prototyping through qualification testing and manufacturing implementation.
• Develop and maintain packaging specifications, artwork, documentation, and bills of material (BOMs).
• Analyze thermal, mechanical, and electrical performance to ensure reliability and compliance.
• Troubleshoot packaging-related issues and deliver technical solutions to internal stakeholders and customers.
• Work with suppliers, QA, and Procurement to establish and manage material specifications and vendor performance.
• Drive process improvements for manufacturability, cost optimization, waste reduction, and sustainability.
• Benchmark industry trends and emerging technologies to identify opportunities for innovation.

Requirements

Key technical skills and experience expected for successful performance in this role.

Must-have

• Practical experience applying engineering and materials science principles to product development.
• Experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Experience in semiconductor manufacturing or advanced packaging process development and assembly equipment.
• Familiarity with reliability testing, failure analysis, and process qualification methods.
• Ability to create and maintain technical documentation and BOMs; strong troubleshooting skills.
• Effective collaboration and communication skills with cross-functional teams and external suppliers.

Nice-to-have

• Experience in high-volume manufacturing or technology development environments.
• Hands-on experience with packaging assembly equipment or manufacturing optimization projects.

Education Requirements

Bachelor’s degree in Mechanical Engineering, Materials Science Engineering, Electrical Engineering, Physics, Chemistry, Optical Engineering, Polymer Science and Engineering, or a related technical field. Candidates with a Bachelor’s are expected to have 1+ years of relevant engineering experience; applicants with a Master’s degree or PhD in Engineering or a related discipline may be considered with no prior experience. Equivalent practical experience may be acceptable where stated by company policy.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.