Product Integration Engineer

Job Title

Product Integration Engineer

Role Summary

Responsible for process integration, qualification readiness, and yield enablement of advanced semiconductor package products at the Taichung Fab 16 site. Works across technology development, NPI, QA, CEM, and operations to deliver manufacturable package architectures and support high-volume production ramp.

Experience Level

Mid-level (5–10+ years of experience in semiconductor advanced packaging and process integration).

Responsibilities

Primary responsibilities include advancing package development, executing NPI phase gates, ensuring qualification readiness, and enabling manufacturing ramp.

• Lead process integration for new package architectures: define materials, structures, and process flows.
• Plan and execute development and qualification builds; analyze data and close learning cycles.
• Perform technical risk assessments, DOE planning, FMEA, and failure mechanism analysis.
• Define and optimize CTQs, process windows, and yield performance targets.
• Own NPI phase-gate deliverables and drive readiness for Qualification Release (QR).
• Lead defect reduction, yield ramp, root-cause analysis, and production transfer activities.
• Coordinate cross-functional program execution and multi-site collaboration; provide technical leadership in reviews and updates.
• Drive continuous improvement to increase process maturity, reduce cycle time, and lower cost.

Requirements

Must-have technical skills and experience for this role.

• 5–10+ years experience in semiconductor advanced packaging and process integration.
• Practical knowledge of advanced packaging technologies (e.g., HBM, 3DS, flip chip, TSV).
• Experience with process integration, yield analysis, defect mechanisms, and reliability validation.
• Proven experience managing NPI/qualification phase gates and executing qualification plans.
• Skilled in technical risk assessment, DOE, FMEA, and root-cause analysis.
• Track record of cross-functional program execution and collaboration across development and manufacturing sites.
• Ability to drive defect-reduction programs and enable high-volume manufacturing readiness.
• Nice-to-have: experience with CEM partners, manufacturing transfers, and large-scale yield ramps.

Education Requirements

Bachelor's or Master's degree in Engineering (Materials, Chemical, Electrical, Mechanical, or related field).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.