Product Engineer (Pkg PE MFG) — Heterogeneous Integration Group (HBM)

Job Title

Product Engineer (Pkg PE MFG) — Heterogeneous Integration Group (HBM)

Role Summary

Member of the HIG HBM Package Product Engineering team responsible for driving package and HBM product engineering activities to improve quality, cost, cycle time and manufacturability at scale.

Work cross-functionally with fab, technology development, package development, design, and quality teams to enable high-volume manufacturing and product performance for next-generation HBM products.

Experience Level

Mid-level. The role requires more than 3 years of experience in the semiconductor industry, preferably in product engineering and packaging.

Responsibilities

Key responsibilities focus on yield, quality, process conversions, and cross-functional technical leadership.

• Improve assembly yield and reduce defects per million (DPM) through assembly coverage and inline fallout prevention.
• Optimize HBM cube yield via test coverage improvements and collaboration with technology and packaging teams.
• Own cumulative yield initiatives across functions to drive measurable quality and yield gains.
• Perform root cause analysis for packaging quality and RMA issues using electrical and physical failure analysis and lead resolution efforts.
• Support backend process conversions and transfer to HVM, providing recommendations to reduce cost and increase yield.
• Coordinate cross-functional efforts with fab, TD, design, system development, and reliability teams to enable shipping of robust products.
• Promote and implement technical innovations that improve competitive position and manufacturing performance.
• Provide project management, technical decision-making, risk analysis, and program prioritization for product initiatives.
• Collaborate on AI/ML model development and validation to improve KPIs such as quality, cost, cycle time, and scale.

Requirements

Essential technical skills, behaviors, and working conditions for success in this role.

• Strong problem-solving and root-cause analysis skills, including in-depth circuit understanding.
• Proficiency with statistics, data analysis tools, and scripting for data-driven yield improvement.
• Proven ability to work collaboratively across teams to address complex engineering and business problems.
• Excellent communication and presentation skills; ability to lead technical programs and mentor others.
• Self-motivated, adaptable to changing roles and priorities, and accountable for assigned work.
• Demonstrated interest or experience in people leadership and ongoing development.
• Work on site in Singapore; international travel to Taiwan, United States, and Japan required as needed.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Electronic Engineering, or Mechanical Engineering. The role specifies more than 3 years of semiconductor industry experience; product engineering and packaging experience is preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.