Product Engineer, Package Product Engineering (HIG) — High Bandwidth Memory (HBM)

Job Title

Product Engineer, Package Product Engineering (HIG) — High Bandwidth Memory (HBM)

Role Summary

Member of the Heterogeneous Integration Group (HIG) HBM Package Product Engineering team responsible for driving package and HBM product engineering activities. Focus on improving quality, cost, cycle time and scale for next-generation HBM products.

The role leads cross-functional yield, test and packaging initiatives, supports process conversions and high-volume manufacturing (HVM), and coordinates failure analysis and corrective actions.

Experience Level

Mid-level — typically 3+ years of semiconductor industry experience.

Responsibilities

Primary technical and cross-functional responsibilities include:

• Improve assembly yield, reduce inline fallout, and lower Time‑0 and field DPM for assembly flows.
• Optimize test coverage and flows to improve HBM cube yield and manufacturing line yield.
• Own cumulative yield initiatives and lead cross-functional projects to improve overall product quality.
• Perform root‑cause analysis using electrical failure analysis (EFA) and physical failure analysis (PFA); drive corrective actions and resolution.
• Support backend process conversions and HVM readiness with Fab, TD, and package development teams to reduce cost and increase yield.
• Collaborate with Fab, Technology Development, Design, System Development, and Quality/Reliability teams to ship products successfully.
• Drive technical improvements and promote innovation to maintain competitive advantage.
• Lead and manage projects, make technical risk and prioritization decisions.
• Work with cross-functional teams to develop, deploy, and validate AI/ML models that improve KPIs (quality, cost, cycle time, scale).

Requirements

Must-have skills and experience; preferred items noted.

• Minimum 3+ years experience in the semiconductor industry; product engineering and packaging experience preferred.
• Strong problem‑solving and root‑cause analysis skills, including in‑depth circuit analysis.
• Proficiency with statistics, data analysis tools, and scripting for data-driven troubleshooting.
• Experience with test flow handling is a plus.
• Experience with assembly processes and advanced packaging is a plus.
• Proven ability to work collaboratively across teams on complex engineering problems.
• Demonstrated accountability, professional work ethic, and strong communication and presentation skills.
• Interest or experience in people leadership and developing others.
• Role requires working on site in Singapore; international travel to Taiwan, US, and Japan may be required.

Education Requirements

Bachelor's or Master’s degree in Electrical, Electronic, or Mechanical Engineering (stated). The posting specifies these degrees; equivalent industry experience is not explicitly stated in the source.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.