Product Engineer, Package Manufacturing (Heterogeneous Integration Group - High Bandwidth Memory)

Job Title

Product Engineer, Package Manufacturing (Heterogeneous Integration Group - High Bandwidth Memory)

Role Summary

Member of the HIG HBM Package Product Engineering team responsible for driving package and HBM product engineering activities to improve quality, cost, cycle time and manufacturability for next-generation HBM products.

Collaborate with global cross-functional teams (Fab, Technology Development, Package Development, Design, Quality/Reliability) to debug manufacturing and packaging issues, own yield improvement initiatives, and enable high-volume manufacturing.

Experience Level

Mid-level. The role expects more than 3 years of experience in the semiconductor industry.

Responsibilities

Primary responsibilities focus on yield, quality, process conversions, cross-functional delivery, and introduction of technical improvements.

• Improve assembly coverage and reduce inline fallout to lower Time 0 and field DPM.
• Optimize test coverage and processes to improve HBM cube yield.
• Lead cross-functional yield and quality improvement initiatives affecting cumulative yield.
• Perform root cause analysis using electrical and physical failure analysis and drive corrective actions.
• Support backend process conversions and establish conversion business processes to enable HVM, cost reduction and yield gains.
• Collaborate with Fab, TD, package development, design and quality teams to deliver products to specification and scale production.
• Promote technical innovation and make risk/priority decisions for projects.
• Develop project management skills and mentor team members; advocate for AI/ML models to improve KPIs (quality, cost, cycle time, scale).
• Work on site in Singapore and travel internationally as required (Taiwan, US, Japan).

Requirements

Must-have technical skills, workplace expectations, and preferred add-ons.

• Must have >3 years semiconductor industry experience (product engineering or similar roles).
• Strong problem-solving and root-cause analysis skills, including in-depth circuit analysis.
• Proficiency with statistics, data analysis tools, and scripting for data-driven analysis.
• Proven collaboration across teams to solve complex engineering and business problems.
• Excellent communication and presentation skills; professional work ethic and accountability.
• Desire and ability to lead technical programs and mentor others.
• Onsite work in Singapore with willingness to travel internationally.
• Nice-to-have: product engineering and packaging experience, test flow handling, assembly process and advanced packaging experience, familiarity with AI/ML model deployment for KPI improvements.

Education Requirements

Bachelor's or Master's degree in Electrical, Electronic, or Mechanical Engineering. The posting specifies Bachelors/Masters of Electrical/Electronic/Mechanical Engineering and expects more than 3 years of semiconductor industry experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.