Product Development Engineer – Thermal Engineering
Advanced Micro DevicesJob Title
Product Development Engineer – Thermal Engineering
Role Summary
Join AMD's advanced packaging and New Product Introduction (NPI) organization as a Thermal Engineer responsible for driving thermal characterization, validation, and technology development for package architectures and next-generation products. The role partners with package design, reliability, manufacturing, test, and product engineering teams to evaluate thermal performance and support product qualification and ramp.
Experience Level
Mid-level. The posting does not specify particular years of experience.
Responsibilities
Key responsibilities focus on thermal characterization, testing, analysis, and cross-functional support from development through production.
- Act as the thermal subject-matter expert for advanced packaging technology development and NPI programs.
- Lead thermal characterization efforts including Thermal Test Vehicle (TTV) development, laboratory testing, data analysis, and validation.
- Develop thermal models and correlate simulation results with measured data.
- Work with cross-functional teams to assess thermal performance, identify risks, and implement corrective solutions.
- Support qualification, product bring-up, manufacturing transfers, and production activities with OSAT partners.
- Investigate thermal issues, perform root-cause analysis, and drive corrective actions.
- Contribute to technology pathfinding and continuous improvement of thermal methodologies and infrastructure.
Requirements
Must-have skills and qualifications required to perform the role effectively, plus a short list of desirable additions.
Must-have:- Hands-on experience in thermal engineering for semiconductor, electronics, data center, or advanced packaging environments.
- Strong understanding of heat transfer principles and practical thermal management techniques.
- Experience with thermal characterization, laboratory testing, and TTV development.
- Experience with thermal modeling and correlating simulation to measurements.
- Experience supporting NPI, qualification, manufacturing transfers, and working with OSAT partners.
- Strong analytical, troubleshooting, communication, and cross-disciplinary collaboration skills.
- Authorized to work in the United States; this role is not eligible for visa sponsorship.
- Experience developing thermal test methodologies and infrastructure for packaging technology pathfinding.
- Prior experience with data-center or high-performance computing thermal challenges.
Education Requirements
Bachelor's degree preferred in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Materials Science & Engineering, or a related engineering discipline. An advanced degree in a relevant engineering field is a plus. (The posting does not state an "equivalent experience" clause.)
About the Company
Company: Advanced Micro Devices
Headquarters: Sunnyvale, California, USA
Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.
