Process Integration Lead

Job Title

Process Integration Lead

Role Summary

Lead Process Integration execution for assigned DRAM modules within Advanced Technology & Engineering (ATE) at the Taichung Fab 16 site. Responsible for yield ramp, stability, integration readiness, technology transfer and early high-volume manufacturing (HVM) support.

Manage a team of PI engineers and coordinate cross-functional activities (Manufacturing, Equipment, Yield, Device, TD, Quality, Design) to protect yield, schedule, and quality. For application accommodations: hrsupport_taiwan@micron.com.

Experience Level

Senior-level. Typical guidance: minimum 5 years of HVM/FAB experience and at least 3 years in semiconductor fabrication roles focused on yield ramp, cost reduction, or quality improvement.

Responsibilities

Primary accountabilities for process integration, ramp readiness, people leadership, and cross-functional coordination.

• Lead day-to-day PI execution and ownership for assigned DRAM modules through technology transfer, pilot, and early HVM phases.
• Own yield ramp, stability, and integration readiness for assigned scope; protect schedule and customer ramp readiness.
• Drive root-cause investigations and corrective actions using DOE, SPC/FDC, FMEA, 8D and structured problem solving.
• Ensure process window margin, manufacturability, and reliability requirements are met and sustained.
• Champion Best-Known Methods (BKM) and site-to-site learning to reduce variability and accelerate learning cycles.
• Coordinate technology transfer activities, NPI, process qualification, inter-fab reviews, gap assessments and corrective-action follow-through.
• Manage and develop PI engineers: set priorities, provide technical guidance and coaching, and conduct performance and development planning.
• Execute and sustain process control strategies, ensure compliance with quality and safety requirements, and support off-shift or flexible schedules during critical ramp phases.

Requirements

Must-have technical and leadership qualifications; preferred items summarized separately below.

• Minimum 5 years HVM or FAB experience; at least 3 years in semiconductor fabrication areas such as yield ramp, cost reduction, or quality improvement.
• Demonstrated experience with root-cause analysis and statistical/problem-solving tools (DOE, SPC/FDC, FMEA, 8D).
• Clear understanding of transistor operation, scaling limitations, reliability, CMOS fundamentals, and characterization methods.
• Proven experience managing and developing engineering staff and driving cross-functional alignment and rapid issue resolution.
• Willingness to support extended international assignments (3+ months) for training and technology transfer when required.

Nice-to-have:

• Experience with TD, Process Integration, Device, Yield analysis, QR, SWR, process transfer, module ownership, ramp-up and trend sustaining.
• Experience in a 300mm semiconductor environment and strong knowledge of tech transfer and development.
• Strong analytical, communication, and teamwork skills; ability to work in fast-paced, time-sensitive environments.

Education Requirements

Bachelor's degree required. Preferred: Master's or Ph.D. in Materials Science, Electrical, Electronics, Chemical or related engineering fields. The role places significant weight on relevant industry experience (HVM/FAB and semiconductor process work) in addition to formal degrees.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.