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Process Integration Development Engineer

Intel Corporation
September 30, 2026
Full-time
On-site
Hillsboro, Oregon, United States
$115,110 - $162,500 USD yearly
Process Engineering Jobs, Level - Mid-Career

Job Title

Process Integration Development Engineer

Role Summary

Perform focused-ion-beam (FIB) sample preparation and advanced transmission electron microscopy (TEM) characterization to support fabrication, failure analysis, process development and process integration in Intel's Foundry labs. Work with engineering teams to optimize metrology strategies, troubleshoot process flows, and deliver timely imaging results that inform technology development.

Experience Level

Mid-level. Typical experience guidance: Masters degree + 2 years, Bachelors degree + 4 years, Associate degree + 8 years of relevant hands-on FIB/TEM industry experience.

Responsibilities

Provide FIB/TEM technical support across development and manufacturing activities; deliver timely, high-quality imaging and analysis.

  • Prepare FIB lamellae and perform advanced TEM characterization (imaging, electron diffraction, strain analysis, EDS, EELS).
  • Operate and maintain advanced focused-ion-beam and transmission electron microscope tools for sample preparation and imaging.
  • Collaborate with process, fabrication, and failure-analysis teams to optimize metrology and troubleshoot process flow issues.
  • Contribute to continuous improvement efforts in high-volume manufacturing environments to reduce time-to-information.
  • Document procedures, results, and technical recommendations; perform other related engineering tasks as required.

Requirements

Must-have

  • Hands-on industry experience with FIB sample preparation and TEM operation for semiconductor nanostructures.
  • Proven track record of practical experience, innovation, and ownership in FIB and TEM workflows.
  • Proficiency with TEM techniques: imaging, electron diffraction, strain analysis, energy-dispersive X-ray spectroscopy (EDS), and electron energy loss spectroscopy (EELS).
  • Ability to collaborate effectively with cross-functional engineering teams and communicate technical results clearly.
  • Experience working under time-sensitive requirements to deliver rapid analysis and actionable data.

Nice-to-have

  • Working knowledge and experience of semiconductor process integration and process development environments.
  • Experience contributing to continuous improvement in high-volume manufacturing.

Education Requirements

Degree options accepted per the posting: Associate degree + 8 years relevant experience, Bachelors degree + 4 years, or Masters degree + 2 years. The posting requires that the work experience be hands-on FIB sample preparation / TEM preparation operation in industry. No specific field-of-study or certifications were specified.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-09-29