Process Engineer, Advanced Packaging
Applied MaterialsJob Title
Process Engineer, Advanced Packaging
Role Summary
Responsible for developing and optimizing advanced packaging processes including wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding. Work includes designing experiments, hardware characterization, data analysis, troubleshooting, root cause analysis, and producing technical documentation. May lead project teams and engage with customers and vendors.
Position may require up to 10% travel; relocation eligible.
Experience Level
Mid-level — 4–7 years of related process engineering or semiconductor packaging experience.
Responsibilities
Key responsibilities include:
- Design, collect, analyze data, and report on complex process engineering experiments.
- Perform hardware characterization and measure film properties; interpret results.
- Troubleshoot complex process issues and perform root cause analysis.
- Implement new technologies, products, and analytical instrumentation.
- Generate internal documentation, technical reports, and presentations.
- Engage with customers to resolve process issues under limited supervision.
- Identify and partner with vendors and suppliers.
- Mentor junior colleagues and lead project teams as required.
Requirements
Must-have qualifications and skills:
- 4–7 years of relevant process engineering or packaging experience.
- Strong analytical skills and proficiency in data analysis.
- Demonstrated ability to solve complex problems and perform root cause analysis.
- Familiarity with device packaging processes, including W2W and D2W bonding.
- Experience with hardware characterization and interpreting film/property measurements.
- Effective verbal and written communication and teamwork skills; ability to work independently.
- Attention to detail and ability to manage multiple tasks.
Preferred:
- Hands-on experience with tool operation and process development in the PCB or semiconductor industry.
- Direct experience with electronic packaging fabrication (W2W/D2W bonding).
Education Requirements
Bachelor's degree required in Electrical, Chemical or Mechanical Engineering, Materials Science, Physics, or a related field; Master's or advanced degree preferred. Related technical degrees or equivalent practical experience may be considered.
About the Company
Company: Applied Materials
Headquarters: Santa Clara, CA, United States
Global leader in materials engineering solutions for the semiconductor and display industries, designing, manufacturing, and servicing equipment used to produce chips and advanced displays worldwide. Enables customers' production of semiconductor devices and display technologies and supports innovations like AI and IoT.
