Process and Integration Engineer, Optoelectronics

Job Title

Process and Integration Engineer, Optoelectronics

Role Summary

Technical lead for facet coating and backend processes in a high-volume, 24/7 optoelectronics manufacturing facility. Drive process development, scale multilayer dielectric coatings, and improve yield, productivity, quality, and reliability across internal operations and subcontractor sites.

Experience Level

Mid-level. Minimum 3 years of semiconductor manufacturing experience with at least 1 year of hands-on thin-film deposition experience for optoelectronic devices.

Responsibilities

Deliver technical solutions, maintain process control, and coordinate cross-functional and subcontractor activities to meet production targets.

• Lead development, optimization, and scale-up of multilayer coatings (AR, HR, passivation) using Ion Beam Sputtering (IBS); design and run DOE to improve batch processes.
• Act as technical authority for facet coating and backend operations including wafer scribing, laser bar handling, and Automated Visual Inspection (AVI).
• Define requirements for new equipment, lead qualification and buyoff of tool purchases and engineering upgrades.
• Implement process control plans, SPC, FMEA, and OCAP; perform root-cause analysis and CAPA to resolve defects and excursions.
• Use metrology (spectroscopic ellipsometry, spectrophotometry, AFM) to monitor film properties and process health.
• Manage subcontractor performance and maintain SOPs and technical documentation across sites.
• Establish KPIs and dashboards; report cycle times, yields, and process metrics to management.

Requirements

Must-have technical skills and experience for successful performance in the role; a short list of nice-to-have items follows.

• Minimum 3 years semiconductor manufacturing experience; at least 1 year hands-on thin-film deposition experience for optoelectronic devices.
• Practical knowledge of vacuum physics and deposition techniques, including Ion Beam Sputtering (IBS) and Atomic Layer Deposition (ALD).
• Familiarity with dielectric coating materials (Al2O3, SiO2, Ta2O5, TiO2, Si3N4).
• Strong statistical and analytical skills: SPC, DOE, FMEA, DMAIC; experience with tools such as JMP, SQL, and Tableau.
• Experience with metrology: spectroscopic ellipsometry, spectrophotometry, and AFM.
• Operational experience with automated bar-handling, wafer scribing/cleaving, Pick-and-Place, AVI tools, and burn-in processes.
• Experience managing equipment lifecycles, qualifications, and engineering change buyoffs.
• Excellent written and verbal communication, detail orientation, and structured problem-solving.

Nice-to-have:

• Practical application of Lean manufacturing methodologies.

Education Requirements

Master's degree in Materials Science, Optical Engineering, Chemical Engineering, or Electrical Engineering required. Ph.D. in one of these fields is preferred.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.