Principal Systems Engineer, Platform Robotics & Vacuum Architecture
Axcelis TechnologiesJob Title
Principal Systems Engineer, Platform Robotics & Vacuum Architecture
Role Summary
Lead system-level architecture for robotics, wafer handling, vacuum, chamber interfaces, and automation across current and next-generation semiconductor tools. The role is based at Axcelis headquarters and works across mechanical, electrical, controls, software, and field teams to turn product requirements into verified production solutions.
This is a hands-on engineering role focused on systems integration, architecture trade studies, verification, and mentoring engineering teams.
Experience Level
Senior - Principal level. Typical experience: 7+ years developing complex electromechanical equipment.
Responsibilities
The principal systems engineer owns platform architecture and drives integration, verification, and supplier decisions for robotics and vacuum systems.
- Serve as system-level technical owner for robotics, wafer handling, vacuum-platform architecture across existing and next-generation equipment.
- Translate product and customer needs into system requirements, interface definitions, performance budgets, and verification plans.
- Lead cross-disciplinary architecture trade studies addressing throughput, wafer safety, particle performance, reliability, serviceability, cost, and platform reuse.
- Lead system integration and root-cause investigations on real hardware; drive troubleshooting across mechanical, electrical, software, controls, and sensors.
- Define and execute subsystem and system-level characterization (motion accuracy, repeatability, vibration, vacuum recovery, fault handling, wafer-transfer robustness).
- Guide supplier technical decisions involving robots, load ports, valves, pumps, gauges, motion components, sensors, and controls.
- Support NPI from concept through verification, production readiness, initial field introduction, and transfer to volume manufacturing.
- Establish reusable platform requirements and design rules across product lines.
- Mentor engineers in systems thinking, interface management, technical trade studies, and verification strategy.
Requirements
Must-have technical skills and experience for successful performance in this role.
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Must-have:
- 7+ years developing complex electromechanical equipment.
- Hands-on experience in at least one area: semiconductor or vacuum-process equipment; industrial robotics or precision wafer/material handling; complex motion-control or factory-automation systems.
- Experience translating product needs into system architecture, requirements, interfaces, and verification plans.
- Demonstrated integration and troubleshooting across mechanical, electrical, software, controls, and sensor systems.
- Experience leading technical trade studies and design reviews.
- Strong experimental design, data analysis, and technical communication skills.
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Nice-to-have / Preferred:
- Experience with vacuum pumps, valves, gauges, conductance, pressure transients, leak checking, and vacuum-control sequences.
- SCARA or articulated robot integration; servo systems, trajectory generation, vibration, kinematics, and motion characterization.
- Experience with EtherCAT, PLCs, embedded/real-time controls, or industrial networks.
- Familiarity with LabView, Python, and/or MATLAB for data analysis and test automation.
- Reliability analysis, FMEA, fault trees, DOE, and system verification experience.
- Creo or equivalent 3D CAD literacy; SEMI S2 and equipment-safety experience.
Education Requirements
BS in Mechanical, Electrical, Mechatronics, Robotics, Systems Engineering, or a related discipline. An advanced degree may substitute for experience (the posting indicates an advanced degree plus 5+ years is an accepted alternative to the 7+ years experience requirement).
About the Company
Company: Axcelis Technologies
Headquarters: Beverly, MA, USA
Global supplier of ion implantation equipment and semiconductor manufacturing technologies. Axcelis designs and manufactures tools and services used in wafer fabrication by leading chipmakers to improve device performance and production yield.
