Principal/Staff Engineer — Advanced Packaging Die-Level Technology Engineering (APTD CEM)

Job Title

Principal/Staff Engineer — Advanced Packaging Die-Level Technology Engineering (APTD CEM)

Role Summary

Develop and enable assembly processes for advanced packaging technologies (wafer-level packaging, die stacking, chip-on-wafer, chip-to-wafer) to meet performance, cost, manufacturability, quality, reliability and schedule targets. Lead process development, equipment evaluation, and transfer of technologies into high-volume manufacturing within Micron's Advanced Packaging Technology Development organization.

Experience Level

Senior-level role (principal/staff). The posting specifies at least 2+ years of semiconductor process development or equipment evaluation experience.

Responsibilities

Primary responsibilities include process development, equipment and materials evaluation, quality improvement, cross-functional coordination, and adoption of AI-assisted tools to improve efficiency and controls.

• Develop, optimize, and scale assembly processes for wafer-level packaging and die-stacking technologies.
• Drive yield improvements, cost reduction, and productivity enhancements.
• Define and establish process management projects to meet node requirements and transfer to production.
• Evaluate, qualify, and plan deployment of new equipment and materials; set process parameters for semiconductor tools.
• Ensure robust quality and defense coverage via measurement, inspection, and testing; correlate defense mechanisms to identify improvements.
• Perform continuous data analysis to establish advanced controls (SPC, DOE) and identify improvement opportunities.
• Coordinate with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test, Product Engineering, and Global Quality for technology integration and product transitions.
• Provide Process of Record (POR) and Model of Record (MOR) documentation for transfer to high-volume manufacturing.
• Integrate AI-assisted tools and insights into daily work to improve efficiency and quality, and share proven AI-enabled enhancements.

Requirements

Must-have technical skills, tools, and experience required for the role.

• 2+ years of semiconductor process development or equipment evaluation experience, preferably in wafer bonding, die stacking, or packaging.
• Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with equipment/process control systems such as E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System).
• Strong data analytics skills to support SPC, DOE, defect analysis, and dashboarding.
• Deep understanding of process flows, process interactions, and the impact of changes on yield, performance, and reliability.
• Proven problem-solving ability, root-cause analysis experience, and tenacity to work under schedule pressure and limited resources.

Education Requirements

B.S., M.S., or Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields; equivalent practical experience acceptable per posting language.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.