Principal/Staff Engineer, Advanced Packaging Die-Level Technology Engineering

Job Title

Principal/Staff Engineer, Advanced Packaging Die-Level Technology Engineering

Role Summary

Lead development and deployment of assembly and die-level packaging processes to meet performance, cost, manufacturability, quality, reliability and schedule targets for high-performance memory products. Work on wafer-level packaging and die stacking technologies and coordinate technology transfer to high-volume manufacturing.

Collaborate across Package Integration, Assembly Engineering, Front End Wafer Fab, Product Engineering, Global Quality and external partners to enable new technology launches and continuous process improvements.

Experience Level

Senior. The posting requests at least 2+ years of semiconductor process development or equipment evaluation experience, and the role title indicates senior-level responsibilities.

Responsibilities

Primary responsibilities focus on process development, equipment/materials evaluation, quality improvement, cross-functional coordination, and integrating AI-assisted tools where appropriate.

• Develop and optimize assembly processes for advanced packaging: wafer-level packaging, die stacking, Chip-on-Wafer, Chip-to-Wafer.
• Drive yield improvements, product quality, cost reduction, and productivity enhancements.
• Define and execute process management projects to meet technology node requirements and scale to production.
• Evaluate, qualify, and plan deployment of new equipment and materials; set process parameters for semiconductor tools.
• Ensure quality and reliability through measurement, inspection, testing, and establishment of defense mechanisms and correlations.
• Perform continuous data analysis to establish advanced process controls and identify improvement opportunities.
• Coordinate technology development strategies and ensure smooth transition from development and qualification to high-volume manufacturing.
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfers.
• Integrate AI-assisted tools and insights into daily work to improve efficiency and quality while following standards and legal requirements.

Requirements

Key technical skills, experience, and personal attributes required for successful performance.

• 2+ years of semiconductor process development or equipment evaluation experience; preferably experience in wafer bonding, die stacking or packaging fields.
• Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with equipment/process control systems such as E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System).
• Strong data analytics skills to support SPC, DOE, defect analysis, and dashboarding.
• Deep understanding of process flows, process interactions, and how changes impact yield, performance, and reliability.
• Proven problem-solving skills, root-cause analysis, and ability to work under timelines with limited resources.

Education Requirements

B.S., M.S., or Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical fields. The posting allows equivalent education or practical experience in lieu of a listed degree.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.