Principal Silicon Engineer

Job Title

Principal Silicon Engineer

Role Summary

Join Microsoft SCHIE's DPU silicon team to lead full-chip and package integration from early design exploration to signoff. The role focuses on C4/package interfaces, chip finishing, RDL optimization, and power delivery across chip and package boundaries.

You will coordinate with internal design teams, package vendors, and tool providers to develop and maintain integration methodologies and drive timely tapeout-quality closure.

Experience Level

Senior — typically requires 7+ years of physical design experience; 10+ years preferred for deeper hands-on responsibilities.

Responsibilities

Key responsibilities include end-to-end full-chip and package integration, planning, and execution:

• Own full-chip/package integration and drive integration milestones through signoff and tapeout.
• Lead early-phase design planning: die-size planning, floorplanning, C4/microbump development, and RDL insertion/optimization.
• Develop, enhance, and maintain full-chip integration methodologies and workflows; collaborate with vendors and tool partners.
• Manage interactions with package teams and vendors to ensure system-level continuity.
• Manage multiple power domains and islands; identify and resolve power-delivery and power-integrity issues.
• Provide guidance for floorplan adjustments and ensure convergent integration processes to achieve package closure.

Requirements

Must-have technical skills and experience:

• 7+ years of physical design experience focused on C4 integration and chip finishing.
• Hands-on experience with ASIC physical design tools (examples: Synopsys DC, Cadence ICC2/Fusion-Compiler, PrimeTime).
• Experience with physical verification tools (example: Mentor/Siemens Calibre).

Nice-to-have:

• 10+ years hands-on physical design experience with emphasis on C4/RDL integration, chip finishing, and signoff.
• Deep expertise in power planning, C4/microbump deployment, and chip/package interfaces.
• Proficiency in flow automation and scripting (TCL, Perl) and tool debug.
• Experience developing package signoff checklists and tracking full-chip integration progress.
• Tapeout experience on advanced nodes (TSMC 5nm process or below).

Education Requirements

Bachelor's degree in Computer Engineering, Electrical Engineering, or a related technical field (as stated). No other specific degrees or certifications were listed.

About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.