Principal Signal Integrity Engineer

Job Title

Principal Signal Integrity Engineer

Role Summary

Be a core technical contributor on Micron’s Interface Pathfinding team, leading signal integrity modeling, analysis, and validation for forward-looking high-speed memory and die-to-die interfaces.

The team investigates circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, emphasizing original analysis, hands-on measurement, and IP development.

Experience Level

Senior - 10+ years of industry experience in signal or power integrity analysis applied to high-speed interface technologies.

Responsibilities

Lead modeling, analysis, and documentation activities that enable early-feasibility and product-adoption decisions for high-speed interfaces.

• Generate and validate interconnect and package electrical models from field-solver extraction through time- and frequency-domain simulation.
• Assess substrate and packaging technologies and translate physical characteristics into channel performance projections.
• Perform SI analysis during feasibility studies and drive I/O and channel co-optimization.
• Develop progressive package and system-level design rules based on electromagnetic analysis.
• Define link budgets and establish sim-to-silicon correlation methodologies.
• Collaborate with circuit/chip design, packaging R&D, and system integration to convert SI findings into actionable guidance.
• Author analysis reports, modeling methodology documents, and design-rule specifications.

Requirements

Must-have technical skills, tools, and experience.

• 10+ years industry experience in SI/PI analysis for high-speed interfaces.
• Extensive application of electromagnetic and transmission-line theory to differential and single-ended interfaces.
• Proven use of time- and frequency-domain simulation tools (ADS, HSPICE, SPECTRE or equivalent).
• Deep experience with electromagnetic field solvers (Q3D, SIWAVE, HFSS or equivalent), including solver setup, meshing strategy, and validation.
• Practical experience with measurement tools (oscilloscopes, TDR, VNA) for SI characterization.
• Ability to take broad ownership, work cross-discipline, and make analytical decisions with program impact.
• Strong written and verbal communication; experience producing technical reports and design rules.

Nice-to-have:

• Familiarity with memory I/O architectures and their SI constraints.
• Experience with advanced packaging (2.5D/3D integration, embedded die, high-density organic substrates) and related EM modeling.
• Post-silicon characterization experience (TDR, insertion loss, eye diagrams, BER correlation).
• Some exposure to optical-link modeling.
• Willingness to apply AI-based methods to modeling and simulation workflows.
• Experience in pathfinding or advanced development environments where analysis methodology is developed.

Education Requirements

MS or PhD in Electrical Engineering or a related field is required; an MS with strong electromagnetic/SI fundamentals is accepted and a PhD is preferred. The role requires demonstrated hands-on modeling, simulation, and measurement capability.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.