Principal/Senior Engineer, Advanced Package Metrology - Real-Time Defect Analysis (MRDA)

Job Title

Principal/Senior Engineer, Advanced Package Metrology - Real-Time Defect Analysis (MRDA)

Role Summary

Join Micron's Advanced Packaging Technology Development (APTD) team to develop and deploy metrology and real-time defect analysis (RDA) solutions for advanced packaging and high-bandwidth memory products. The role focuses on inspection/measurement recipe development, in-line characterization, tool ownership, data-driven problem solving and cross-functional integration to support manufacturing transfer and yield improvement.

This position works with package integration, assembly/test, front-end wafer fab, product engineering and global quality to enable scalable metrology strategies and equipment evaluations for advanced packaging roadmaps.

Experience Level

Level: Senior. The posting specifies a minimum of 2+ years of semiconductor process or equipment engineering experience; the role expects experienced engineers capable of leading metrology/RDA efforts and cross-functional projects.

Responsibilities

The core responsibilities include developing metrology techniques, deploying RDA capabilities, and enabling manufacturing readiness:

• Develop and optimize metrology/inspection recipes for advanced packaging processes.
• Establish inspection methodologies and best-known methods (BKM); perform in-line characterization and validation of recipes.
• Define process monitoring, sampling plans, and continuous improvement (CIP) strategies.
• Analyze process and defect data; produce dashboards and reports (Power BI) to track metrics and identify improvement opportunities.
• Own and manage metrology tools; define control plans, OCAPs and SPC charts to meet quality and performance indicators.
• Lead equipment evaluation and long-range metrology strategy aligned to packaging roadmaps.
• Coordinate cross-functional integration with package integration, PWF/assembly, front-end, product engineering and global quality.
• Integrate AI-assisted tools and data-driven techniques to improve efficiency and defect analysis while following organizational standards and legal requirements.

Requirements

Must-have technical skills and experience (education listed separately):

• Minimum 2 years semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control or packaging.
• Proficiency in Python, R and SQL for statistical analysis, process modeling and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification) and RMS (Recipe Management System) for equipment/process control.
• Strong data-analytics skills to support SPC, DOE, defect analysis and dashboarding.
• Hands-on experience with wafer/assembly tools or metrology/RDA systems.
• Proven problem-solving skills, root-cause analysis experience, and ability to work under timelines and limited resources.
• Role-appropriate digital fluency and AI literacy to use AI-enabled tools responsibly and effectively.

Education Requirements

B.S., M.S. or Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics or related technical fields; equivalent practical experience accepted.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.