Principal/Senior Engineer, Advanced Package Metrology - Real-Time Defect Analysis (MRDA)

Job Title

Principal/Senior Engineer, Advanced Package Metrology - Real-Time Defect Analysis (MRDA)

Role Summary

Join Advanced Packaging Technology Development (APTD) to develop and enable inspection, metrology, and real-time defect analysis (RDA) solutions for high-performance memory packaging. The role focuses on recipe development, in-line characterization, data-driven defect analysis, and equipment evaluation to support technology transfer to manufacturing.

Experience Level

Senior level. The posting requests 2+ years of semiconductor process or equipment engineering experience, and the title indicates a principal/senior role.

Responsibilities

Deliver metrology and RDA capabilities that improve yield and enable advanced packaging roadmaps. Work cross-functionally to qualify, launch, and control metrology systems and processes.

• Develop and optimize metrology and inspection recipes for advanced packaging processes; implement process monitoring and continuous improvement (CIP).
• Establish inspection methodologies and best-known methods (BKMs); perform in-line characterization and validation of recipes.
• Analyze metrology and process data to identify defects, root causes, and improvement opportunities; support SPC, DOE, and dashboarding.
• Manage metrology tools and performance indicators; create control plans, OCAPs, and SPC charts to maintain quality.
• Define equipment evaluation criteria and contribute to long-range metrology strategy for packaging roadmaps.
• Coordinate across Package Integration, Assembly/Test, PWF/Assembly Engineering, Front-End, Product Engineering, and Global Quality for process integration.
• Integrate AI-assisted tools and insights into workflows to improve efficiency and defect detection, applying sound judgment and compliance with standards.

Requirements

Key must-have skills and experience for the role.

• 2+ years of semiconductor process or equipment engineering experience; experience preferred in wafer bonding, plating, warpage control, or packaging.
• Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with equipment/process control systems such as E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System).
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboard creation (Power BI experience noted).
• Hands-on experience with wafer/assembly tools or metrology/RDA systems.
• Proven problem-solving skills, tenacity under timelines and limited resources, and ability to drive root-cause resolution.
• Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively.

Education Requirements

B.S./M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or a related technical field; or equivalent practical experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.