Principal/Senior Advanced Packaging Development Process Engineer

Job Title

Principal/Senior Advanced Packaging Development Process Engineer

Role Summary

Lead development and qualification of advanced semiconductor packaging and assembly technologies to support next-generation memory products. Work across process development, characterization, integration, and transfer to manufacturing with cross-functional teams (Materials, Equipment, Reliability, Design, Manufacturing, Quality).

Experience Level

Senior-level. Minimum 3 years of experience in semiconductor process development, process integration, advanced packaging, or assembly technology.

Responsibilities

Primary responsibilities include technology development, process optimization, and enabling high-volume manufacturing readiness.

• Develop and qualify advanced packaging and assembly technologies such as hybrid bonding, thermo-compression bonding (TCB), and flip chip.
• Design, execute, and analyze DOE to optimize process performance, yield, reliability, and manufacturability.
• Lead process setup, characterization, defect reduction, and process window optimization for new packaging flows.
• Perform technical data analysis and root-cause investigations using statistical methods.
• Collaborate with cross-functional and global teams to integrate processes and prepare manufacturing transfer packages.
• Evaluate and qualify new materials, equipment, and process technologies with suppliers and internal stakeholders.
• Drive process troubleshooting, yield improvement, and defect reduction using systematic problem-solving.
• Maintain process documentation, qualification reports, specifications, and manufacturing-transfer deliverables.
• Monitor process health using SPC, FDC, metrology, and reliability data to ensure stability and capability.
• Apply automation, advanced analytics, and AI tools to improve development efficiency and failure analysis.

Requirements

Concise list of must-have skills and preferred capabilities.

• Minimum 3 years of relevant semiconductor process development, integration, or advanced packaging experience.
• Hands-on experience in one or more: hybrid bonding (C2W/W2W/D2D), thermo-compression bonding (TCB), or flip chip assembly.
• Proven experience with DOE methodologies, process characterization, and statistical data analysis.
• Demonstrated ability to manage complex technical projects and drive results independently.
• Effective written and verbal communication in English and strong cross-functional collaboration skills.

• Experience with HBM, 2.5D/3D packaging, chiplet integration, or advanced memory packaging.
• Knowledge of package reliability, failure analysis, SPC/FDC, and advanced metrology tools.
• Familiarity with AI/ML, automation, or data analytics applied to process development.
• Experience transferring R&D technologies to high-volume manufacturing and working with external suppliers.

Education Requirements

Master's degree or higher in Materials Science, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.