Job Title
Principal RF Designer and Architect (Research)
Role Summary
Technical lead responsible for design and development of mixed-signal RF and microwave integrated assemblies used for command, communications, control and interface of radio electronics. Work within the Systems, Research & Technology team and lead cross-functional engineering efforts from requirements and architecture through hardware prototyping and verification.
Focus areas include RF/analog/digital circuit design, PCB/SMT assembly integration, simulation and verification for infrastructure and defense applications. Travel within the U.S. up to 25%.
Experience Level
Senior-level (Professional). The role expects experienced candidates; posting indicates ~12+ years of relevant experience.
Responsibilities
Lead design, integration and verification activities for RF mixed-signal assemblies and associated signal chains.
- Lead multiple cross-functional and cross-site engineering teams to deliver RF integrated assemblies.
- Define requirements, specifications and subsystem partitioning for assemblies and RF interfaces.
- Perform linear, non-linear and time-domain simulations to evaluate architectures and trade-offs.
- Specify components, generate schematics, BOMs and oversee PCB layout and thermal considerations.
- Build hardware demonstrators, perform bench validation, and iterate designs to meet specs.
- Develop test plans, automated test strategies, and generate verification documentation and reports.
- Support firmware teams with embedded controller hardware design and pin assignments.
- Engage with customers and partners; present proposals, technical options and risk assessments.
Requirements
Must-have technical skills and experience; concise list of preferred additional skills follows.
- 12+ years of experience in RF, microwave, communications, military or infrastructure industries.
- Extensive analog circuit design experience (op amps, discrete devices) and mixed-signal design.
- Strong RF & microwave circuit design skills: amplifiers, filters, compensation, up/down conversion.
- Experience with ADC/DAC, data acquisition, multiplexing, quantization and dynamic range analysis.
- Proficiency in time-domain simulation (SPICE) and other linear/non-linear simulation tools.
- Practical experience with PCB/SMT assembly design, schematic capture, BOM generation and PCB layout.
- Hands-on prototyping skills, bench troubleshooting, hand-soldering SMT components and test equipment (AWG, spectrum/analyzers, mixed-signal scopes).
- Experience with embedded controller hardware design and basic digital logic interfacing.
- Ability to produce clear documentation, test plans and to communicate effectively with cross-functional teams and customers.
- Willingness to travel within the U.S. (up to ~25%).
Nice-to-have: experience with semiconductor devices such as HBT or GaN, power-management switching converters, thermal/reliability analysis, and advanced transmitter/receiver architectures.
Education Requirements
Minimum: M.S. in Electrical Engineering (MSEE) or equivalent. Ph.D. preferred. Degrees in Electrical Engineering, Computer Engineering or closely related technical fields, or equivalent practical experience, are acceptable.
About the Company
Company: Qorvo
Headquarters: Greensboro, NC, US
Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.

Date Posted: 2026-06-29