Principal Product Engineer

Job Title

Principal Product Engineer

Role Summary

Principal Product Engineer on Microsoft's Silicon Manufacturing & Packaging Engineering (SMPE) team within Compute Silicon & Manufacturing Engineering (CSME). The role leads product and test engineering for new IC product development, manufacturing, test-program implementation, and post-silicon bring-up to deliver cloud server chips at scale.

Focus areas include pre- and post-silicon power/performance readiness, ATE test program development and optimization, manufacturing fuse/data flows, yield and qualification activities, and cross-functional vendor and program leadership.

Experience Level

Senior-level. Typical candidates have multi-year senior experience in product development, test engineering, and semiconductor manufacturing (many preferred candidates have 8–10+ years of relevant engineering experience).

Responsibilities

Accountable for product engineering from definition through launch, with ownership of test and manufacturing readiness.

• Lead pre-silicon readiness for power, performance, thermal and power-delivery features and ensure successful first power-on bring-up.
• Drive post-silicon power and performance tuning with platform teams.
• Implement and optimize ATE test programs for SOC power/TDP and binning.
• Define product manufacturing fuse requirements and manage end-to-end fusing data flows across test sockets.
• Characterize, debug, and analyze yield and test data; drive yield recovery and repair strategies.
• Manage external vendors and cross-functional teams; lead sub-projects within larger development programs.
• Coordinate sample delivery milestones and new-product introduction activities across the life cycle.

Requirements

Must-have technical skills, security prerequisites, and practical experience for the role.

• Proven experience in semiconductor IC development, manufacturing, fabrication, testing, and packaging.
• Hands-on experience developing, bringing up, and optimizing ATE test programs and test methods; strong characterization and debug skills.
• Knowledge of DFT, silicon fabrication process, product qualification & reliability, and basic transistor/device behavior.
• Experience with power/performance modeling, ATE binning strategies, and collecting required characterization data for power/performance optimization.
• Experience with yield analysis, failure analysis, redundancy/repair strategies, and implementing corrective actions through test content and procedures.
• Program and project leadership: managing suppliers, partners, cross-functional teams, and sample/product delivery milestones.
• Strong communication and presentation skills; effective stakeholder influence and customer focus.
• Ability to meet Microsoft security screening and export-control requirements (background checks and verification of citizenship/residency documentation as required for access to controlled information).

Education Requirements

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field with 3+ years technical engineering experience; OR Master’s in those fields with 6+ years; OR Bachelor’s in those fields with 8+ years; OR equivalent practical experience. Fields referenced include Electrical Engineering, Computer Engineering, Computer Science, or related technical disciplines.

About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.