Principal Physical Design Engineer
Principal-level individual contributor on Microsoft Silicon within the Cloud Hardware and Infrastructure Engineering organization. The role focuses on physical implementation (place-and-route, STA, PV, FEV, ECOs, clocking, IR-drop/EM) for next-generation AI SoCs and related blocks/subchips.
Work with cross-functional teams to define and deliver tools, flows, methodologies, and quality checks that enable tapeouts and high-volume manufacturing of cloud hardware.
Senior / Principal. Typically requires extensive hands-on physical design and tapeout experience (generally 8+ years of relevant technical engineering experience or equivalent).
Primary responsibilities include execution and leadership of physical design tasks and delivery of tool/flow/methodology for block, sub-chip, and full-chip implementation.
Must-have skills and conditions for the role.
Nice-to-have:
Doctorate (PhD) in Electrical Engineering, Computer Engineering, Computer Science, or related field (plus 3+ years technical engineering experience), OR Master's degree in those fields (plus 6+ years), OR Bachelor's degree in those fields (plus 8+ years), OR equivalent practical experience. Fields explicitly mentioned: Electrical Engineering, Computer Engineering, Computer Science, or related technical disciplines.
Company: Microsoft
Headquarters: Redmond, Washington, United States
Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.
