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Principal Physical Design Engineer

Hewlett Packard Enterprise
September 14, 2026
Full-time
On-site
Sunnyvale, California, United States
$174,000 - $352,500 USD yearly
Physical Design Jobs, Level - Senior

Job Title

Principal Physical Design Engineer

Role Summary

The Principal Physical Design Engineer will develop and maintain RTL-to-GDS place-and-route (P&R) flows and methodology for advanced ASIC designs. The role partners with RTL, analog/mixed-signal, EDA, PDK/library, and signoff teams to deliver scalable, robust physical implementation flows and high-quality silicon.

Experience Level

Senior - typically requires 7–10+ years of experience in ASIC physical design flows or physical design methodology.

Responsibilities

Primary responsibilities include flow development, implementation support, signoff quality, and cross-team collaboration.

  • Develop, maintain, and enhance RTL-to-GDS flows using Cadence Innovus and Synopsys Fusion Compiler.
  • Create repeatable methodologies for floorplanning, placement, CTS, routing, and optimization.
  • Automate flow steps using Tcl, Python, Make-based infrastructures, and Linux tooling.
  • Provide hands-on support for floorplan definition, clock topology, power grid planning, placement optimization, timing closure, IR/EM mitigation, and DRC fixing.
  • Debug tool convergence issues and resolve signoff discrepancies across STA, LVS, DRC, and extraction.
  • Drive correlation improvements between implementation tools and signoff tools (PrimeTime, StarRC, Voltus, RedHawk, Calibre).
  • Collaborate with EDA, PDK/library, architecture, and design teams to evaluate tools and scale flows for next-generation technologies.

Requirements

Must-have technical skills and preferred additions are listed below.

  • Must-have:
    • 7–10+ years in ASIC physical design flows or methodology (P&R development or implementation).
    • Hands-on experience with Cadence Innovus and/or Synopsys Fusion Compiler.
    • Strong knowledge of floorplan, placement, CTS, routing, ECO flows, and timing concepts (setup/hold, OCV/AOCV/POCV).
    • Experience with power/thermal integrity (IR drop, EM) and DRC/LVS signoff flows.
    • Proven ability to troubleshoot complex tool, flow, or methodology issues across PD and signoff.
    • Scripting skills in Tcl and Python; familiarity with Linux shell and Make-based automation.
  • Nice-to-have:
    • Experience with advanced process nodes (7 nm, 5 nm, or below).
    • Familiarity with UPF/low-power flows, hierarchical P&R, and multi-clock-domain designs.
    • Experience with version control (Git/Perforce) and CI automation.
    • Knowledge of extraction and signoff tools (StarRC, PrimeTime, Voltus, RedHawk, Calibre).

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field.


About the Company

Company: Hewlett Packard Enterprise

Headquarters: Spring, TX, United States

Global enterprise technology company delivering hybrid cloud, edge-to-cloud platforms, servers, storage, networking, and IT services to help organizations build, run, and secure applications and infrastructure at scale.

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Date Posted: 2026-09-14