Principal Photonics Integration Engineer

Job Title

Principal Photonics Integration Engineer

Role Summary

The Principal Photonics Integration Engineer will lead development and integration of silicon photonics and heterogeneous integration technologies to enable high-performance optical connectivity. The role spans process integration, advanced packaging, device development, and program leadership to advance concepts to manufacturing readiness.

This position sits in Advanced Packaging Technology Development and works cross-functionally with design, device, packaging, manufacturing, and supplier teams to solve complex technical challenges and influence technology roadmaps.

Experience Level

Senior / Principal level. Typical experience guidance from the posting: PhD + >3 years industry experience, or Master's + >5 years, or Bachelor's + ≥7 years (equivalent practical experience considered).

Responsibilities

Primary responsibilities include:

• Develop and optimize end-to-end process integration flows for silicon photonics from concept through manufacturing readiness.
• Lead integration and process development for photonic devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures.
• Drive process characterization, design-of-experiments (DOE) execution, yield improvement, defect reduction, and root-cause investigations.
• Partner with design, device, packaging, manufacturing, and suppliers to define design rules, execute tapeouts, and perform technology transfers.
• Lead technical programs, define technology roadmaps, and direct AI-enabled engineering initiatives to accelerate development.
• Provide technical leadership across multi-functional teams and mentor engineering staff.

Requirements

Must-have technical skills and experience:

• Experience integrating silicon photonics processes in semiconductor development or manufacturing environments.
• Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis.
• Experience with process flow architecture, device integration, design rule development, and tapeout execution.
• Proven track record leading multi-functional technical projects and using data-driven approaches to solve engineering challenges.
• Ability to collaborate effectively with cross-functional partners and external suppliers for technology transfer and scale-up.

Nice-to-have:

• Experience with III-V materials, heterogeneous integration platforms, hybrid bonding, wafer bonding, optical interposers, or co-packaged optics.
• Familiarity with optical interconnect technologies for datacenter, networking, AI accelerators, HPC, or memory applications.
• Experience applying AI/machine learning, advanced analytics, or workflow automation to engineering and manufacturing problems.
• Strong communication, program leadership, and project management skills for influencing technical and business collaborators.

Education Requirements

PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or a related technical field (preferred) OR equivalent practical experience. Alternatives accepted per posting: Master's degree (or comparable experience) with >5 years relevant industry experience, or Bachelor's degree (or equivalent experience) with ≈7+ years. The posting explicitly allows equivalent practical experience in lieu of degree qualifications.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.