Principal Photonics Integration Engineer

Job Title

Principal Photonics Integration Engineer

Role Summary

Lead the development and integration of silicon photonics and heterogeneous integration technologies within the Advanced Packaging Technology Development team. Own process integration, device and packaging development, and program leadership to move technologies from concept through manufacturing readiness.

Experience Level

Senior (Principal) engineering role. This is a technical leadership position; candidates are evaluated for hire level based on experience and technical depth. See Education Requirements for formal years-of-experience guidance tied to degree level.

Responsibilities

Execute and lead process, device, and packaging integration activities to enable high-performance optical connectivity solutions.

• Develop and optimize end-to-end process integration flows for silicon photonics from concept to manufacturing readiness.
• Lead integration and process development for photonic devices, optical interconnects, advanced packaging, and heterogeneous integration architectures.
• Drive process characterization, design-of-experiments (DOE), yield improvement, defect reduction, root-cause investigations, and process optimization.
• Partner with design, device, packaging, manufacturing, and supplier teams on design rules, tapeouts, and technology transfers.
• Lead technical programs, define technology roadmaps, and implement AI-enabled engineering initiatives to improve development efficiency and product performance.

Requirements

Must-have technical skills and demonstrated experience; preferred items listed separately.

• Proven experience integrating silicon photonics processes in semiconductor development or manufacturing environments.
• Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis.
• Experience with process flow architecture, device integration, design rule development, and tapeout execution.
• Track record of leading multi-functional technical projects and applying data-driven approaches to solve complex engineering problems.
• Experience driving yield improvement, defect reduction, and root-cause analysis.

• Nice-to-have: Experience with III-V technologies and heterogeneous integration platforms.
• Experience with advanced packaging technologies such as hybrid bonding, wafer bonding, optical interposers, co-packaged optics, and optical packaging.
• Knowledge of optical interconnect technologies for datacenter, networking, AI accelerators, HPC, or memory applications.
• Experience applying AI, machine learning, advanced analytics, or automation to engineering and manufacturing workflows.
• Strong communication, program leadership, and project management skills.

Education Requirements

PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or related field preferred (PhD + >3 years industry experience). Alternatively, a Master’s degree (or comparable experience) with >5 years relevant industry experience, or a Bachelor’s degree (or equivalent experience) with >7 years industry experience. "Or equivalent practical experience" is accepted.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.