Principal Packaging Integration Engineer (2026 New College Graduate)

Job Title

Principal Packaging Integration Engineer (2026 New College Graduate)

Role Summary

Hands-on packaging integration engineer responsible for delivering electro-optical transceivers using GF's Photonix platform and advanced 2.5D/3D co-packaged optics. The role focuses on thermal, mechanical, electrical and optical chip-package co-design to meet product performance, reliability, manufacturability and cost targets.

Works cross-functionally with product teams, manufacturing and OSAT partners to define packaging requirements, design rules, materials selection, and to enable customer product transitions into production.

Experience Level

Senior. Typically expects 2+ years of relevant industry experience.

Responsibilities

Primary duties include design enablement, cross-functional coordination, and ensuring manufacturable, reliable packaged products.

• Lead packaging design and integration for SiPh products and co-packaged optics (2.5D/3D) to meet electrical, photonic and thermal requirements.
• Define packaging design rules, materials selection, and module-level requirements for chiplets and products.
• Support customer product development and transition into production; enable design reviews and customer interactions.
• Develop and execute analysis and simulation models to predict manufacturability, cost, thermal and mechanical performance.
• Drive cross-functional problem solving for technical and yield issues; implement continuous improvement plans (CIP).
• Develop engineering team skills and promote a consistent global design and qualification process.
• Perform work in compliance with Environmental, Health, Safety & Security programs; travel up to 10%.

Requirements

Must-have technical skills and experience required for immediate contribution.

• Proven experience taking packaged products from development into production.
• Hands-on expertise with electromagnetic/thermal/mechanical modeling tools such as HFSS, Zmax, Flotherm, or similar.
• Advanced packaging design and layout experience for high-density/photonic interconnects.
• Ability to develop complex analysis models for manufacturability, cost and quality trade-offs.
• Effective written and verbal communication skills for cross-functional and customer interactions.

Nice-to-have:

• Experience with failure analysis, design of experiments, and packaging process integration.
• Track record of photonic and electrical interconnect innovation and product releases with internal teams or OSAT partners.
• Expertise in chip-package interaction across 2D, 2.5D, 3D and related advanced packaging technologies.

Education Requirements

Required: PhD, or a Master's degree plus 2 or more years of relevant experience. Preferred backgrounds include materials science, thermal/mechanical engineering, simulation, photonics, or related technical fields.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.