Principal Packaging Integration Engineer

Job Title

Principal Packaging Integration Engineer

Role Summary

Hands-on assembly process integration engineer responsible for delivering electro-optical transceivers and co-packaged optics modules using GF’s Photonix platform and advanced packaging (2.5D/3D) form factors. The role focuses on tool-process interactions, product and module reliability, packaging design rules, materials selection, and qualification test plans for electrical, photonic, and thermal stresses.

Experience Level

Senior — Principal-level role. The posting indicates advanced experience is expected (see Education Requirements for degree/experience guidance).

Responsibilities

Accountabilities and primary duties:

• Define process integration specifications for co-packaged optics and SiPh flip-chip assembly to meet cost, yield, and reliability targets.
• Establish manufacturing-driven design rules, materials selection criteria, and conduct packaging design reviews and FMEAs.
• Develop electrical, photonic, and thermal stress plans for chiplet and module reliability qualifications.
• Drive packaging design enablement and product innovations with internal teams and OSAT partners.
• Analyze quality and failure issues, quantify financial impact, and drive corrective actions.
• Standardize site quality processes and lead consistent global qualification and robustness efforts.
• Support product transfer from development to production; resolve process integration and yield concerns through cross-functional collaboration.
• Develop and improve test structures and characterization methods; perform DOE and data analysis to accelerate qualification.
• Perform work in a safe manner in compliance with EHS requirements; travel under 10% as required.

Requirements

Must-have — required skills and experience:

• Experience with failure analysis, design of experiments (DOE), and packaging process integration.
• Proven experience bringing packaged products from development into production.
• Hands-on experience resolving process integration and yield issues; familiarity with tool-process interactions for advanced packaging.
• Strong written and verbal English communication skills.

Nice-to-have — preferred skills and background:

• Materials science, thermal, mechanical, or simulation background.
• Validated record of photonic and electrical interconnect innovation and product releases with internal teams or OSAT partners.
• Expertise in chip-package interactions for 2D, 2.5D, 3D SiPh advanced packaging and awareness of global technology and commercial trends.

Education Requirements

PhD preferred; alternatively a Master’s degree plus a minimum of 2 years of relevant experience (stated as "PhD, or MS + 2 or more years of experience"). Preferred backgrounds mentioned include materials science, thermal, mechanical engineering, or simulation-related fields.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.