Principal Packaging Engineer

Job Title

Principal Packaging Engineer

Role Summary

Lead thermal characterization and test automation for RF packaged devices in the Greensboro Thermal Lab. The role owns infrared-microscope-based measurements from setup through data interpretation and communicates findings to design, applications, reliability, and quality teams.

Experience Level

Senior-level. The posting requests 8+ years of relevant experience or an equivalent amount of advanced education and experience.

Responsibilities

Key responsibilities focus on thermal test execution, automation, data analysis, and cross-functional communication.

• Lead infrared-microscope-based thermal characterization of RF packaged devices (open-face and overmolded).
• Set up and troubleshoot electrical/RF test conditions using DC supplies, RF generators, power meters/sensors, amplifiers, network analyzers, and arbitrary waveform generators.
• Develop test methodologies correlating thermal performance with RF operating conditions (Pin/Pout, efficiency, junction temperature).
• Build and maintain automation scripts to control instrumentation and streamline data acquisition, analysis, and reporting.
• Author engineering reports and present thermal findings and recommendations to design, applications, reliability, and quality teams.
• Guide sample preparation and optical access processes, including board/fixture considerations and die milling/polishing.
• Evaluate new thermal measurement equipment and techniques; mentor technicians on test execution and data integrity.

Requirements

Must-have technical skills and hands-on lab experience; education details are summarized in the Education Requirements section below.

• Must-have: Solid understanding of RF device operation (power amplifiers, switches) and package-level thermal behavior (thermal resistance, heat spreading, die-attach effects).
• Must-have: Demonstrated coding/scripting ability for instrument automation and data analysis (Python, MATLAB, LabVIEW, or equivalent).
• Must-have: Hands-on experience with RF and lab equipment: DC power supplies, signal generators, power meters/sensors, amplifiers, network analyzers, and signal analyzers.
• Must-have: Experience developing test methodologies that correlate thermal measurements with electrical/RF performance.
• Proven ability to prepare samples and fixtures for optical thermal access and to ensure data integrity.
• Strong attention to detail and clear written/verbal communication for cross-functional collaboration.
• Experience mentoring or guiding technicians and evaluating lab measurement techniques and equipment.

Education Requirements

Master's degree in Electrical Engineering, Physics, or a related field is specified. The posting also allows an equivalent amount of advanced education and experience.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.